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MJD18002D2T4G

Onsemi

MJD18002D2T4G by Onsemi

MJD18002D2T4G by Onsemi is a NPN BJT transistor with 450V VCEO, 2A IC, and 50W Ptot. Ideal for switching applications, it features a built-in diode in a small outline package suitable for surface mount technology. With an hFE of 6 and fT of 13MHz, this transistor operates b/w -65 °C to +150°C.

Median Price

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Lifecycle Status

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2

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1k+

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Vyrian

USA . 4,976 parts In-Stock

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Digiode

USA . 140 parts In-Stock

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Benley Electronics

USA . 6 parts In-Stock

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$0.500

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6

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AZTECH Wire

Italy . 699 parts In-Stock

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$17.380

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 15,618 parts In-Stock

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Kepictronics

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SupplyDigital Components

Austria . 7,717 parts In-Stock

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Kulean Microsystems

USA . 6,904 parts In-Stock

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Problanco Electronics

Mexico . 4,076 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,700 parts In-Stock

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Corphita

USA . 1,187 parts In-Stock

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UHIMA Technologies

Türkiye . 756 parts In-Stock

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TANS Electronics

Latvia . 581 parts In-Stock

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Corohmni

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Overview

Experience the exceptional quality and reliability of Onsemi with the MJD18002D2T4G Power Bipolar Junction Transistor. Ideal for switching applications, this NPN transistor offers a maximum collector-emitter voltage of 450V and a maximum operating temperature of 150 °C. With a small outline package style and gull wing terminal form, this transistor is designed for easy surface mount installation. Trust in Onsemi's reputation for innovation and excellence to deliver superior performance and efficiency in your electronic designs. Discover the value and benefits of the MJD18002D2T4G for your next project today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the transistor, making it durable and reliable for various applications.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplification and switching circuits, offering flexibility and versatility in circuit design.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient switching and protection against reverse voltage, enhancing the overall performance of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast response times and reliable performance in high-speed circuits.

Surface Mount: YES

Suitable for automated assembly processes and compact designs, making it ideal for applications where space is limited.

Package Shape: RECTANGULAR

Easy to handle and mount on PCBs, ensuring convenient installation and maintenance of the transistor in various electronic devices.

Maximum Power Dissipation (Abs): 50 W

Capable of handling high power levels, making it suitable for applications that require efficient power management and heat dissipation.

Minimum DC Current Gain (hFE): 6

Provides consistent and stable amplification of current, ensuring reliable performance in different circuit configurations.

Maximum Collector-Emitter Voltage: 450 V

Can withstand high voltage levels, making it suitable for use in circuits that require high voltage switching and control.

Nominal Transition Frequency (fT): 13 MHz

Offers good frequency response, allowing for high-speed switching and amplification in various electronic applications.

Technical Specifications

Power Bipolar Junction Transistors (BJT) MJD18002D2T4G attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Additional Features:

FREE WHEELING DIODE

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

2 A

Maximum Collector-Emitter Voltage:

450 V

Minimum DC Current Gain (hFE):

6

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-65 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

MJD18002D2T4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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