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MC74VHCT244AMEL

Onsemi

MC74VHCT244AMEL by Onsemi

MC74VHCT244AMEL by Onsemi is a 20-terminal bus driver with 2 functions. It operates at a supply voltage of 5V, has a propagation delay of 9.5ns, and supports a load capacitance of 50pF. Ideal for industrial applications requiring true output polarity and enable low control type.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,605 parts In-Stock

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5,605

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Digiode

USA . 1,329 parts In-Stock

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1,329

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 374 parts In-Stock

1+ parts

$12.650

100+ parts

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374

$12.650

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QUARKTWIN TECHNOLOGY LTD

USA . 21,958 parts In-Stock

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21,958

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Kulean Microsystems

USA . 8,234 parts In-Stock

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8,234

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Problanco Electronics

Mexico . 7,569 parts In-Stock

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7,569

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TANS Electronics

Latvia . 4,820 parts In-Stock

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4,820

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Microchip USA

USA . 4,784 parts In-Stock

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4,784

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SupplyDigital Components

Austria . 1,948 parts In-Stock

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1,948

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Corphita

USA . 1,227 parts In-Stock

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1,227

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Assy Fe

Spain . 1,020 parts In-Stock

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1,020

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UHIMA Technologies

Türkiye . 604 parts In-Stock

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604

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Corohmni

South Africa . 204 parts In-Stock

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204

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Overview

Unlock the power of seamless data transmission with the MC74VHCT244AMEL by Onsemi. Crafted with precision and expertise, this bus driver & transceiver device offers reliable performance and efficient signal transfer. Ideal for a wide range of applications, this product provides customers with unmatched value and benefits. Experience enhanced connectivity, faster response times, and superior quality with Onsemi's innovative technology. Trust Onsemi to deliver excellence in every product, empowering you to stay connected and productive. Elevate your communication systems with the MC74VHCT244AMEL and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, perfect for applications where weight and durability are important factors.

Propagation Delay At Nominal Supply: 10.5 ns

The low propagation delay ensures fast and efficient data transmission, making this product suitable for high-speed applications.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on PCBs, saving space and simplifying the manufacturing process.

No. of Functions: 2

Having multiple functions in a single component reduces the need for additional components, simplifying the circuit design and saving cost.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of space on the PCB, ideal for applications with limited board real estate.

No. of Bits: 4

With a 4-bit configuration, this product can handle a wide range of data processing tasks, making it versatile and suitable for various applications.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage is common and easily accessible, making it compatible with a wide range of electronic systems and power sources.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF ensures stable and reliable performance in various operating conditions, making this product suitable for demanding applications.

Power Supplies (V): 5

Having a single 5V power supply simplifies the power management requirements, reducing complexity and cost in the overall system design.

No. of Terminals: 20

The 20 terminals provide ample connectivity options and flexibility for interfacing with other components, making this product versatile and easy to integrate into different systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for compact electronic devices and applications where size is a critical factor.

Maximum I (ol): 8 Amp

The high maximum output current of 8 Amp allows this product to drive power-hungry loads with ease, making it suitable for applications requiring high current delivery.

Propagation Delay (tpd): 9.5 ns

The low propagation delay of 9.5 ns ensures fast signal transmission, minimizing signal lag and improving overall system performance.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product can withstand elevated temperatures, making it suitable for industrial applications and harsh environments.

Output Characteristics: 3-STATE

The 3-STATE output characteristics provide additional flexibility in controlling the output signals, allowing for efficient interfacing with other components and systems.

Minimum Operating Temperature: -40 °C

The wide temperature range of -40 °C to 85°C ensures reliable operation in extreme temperature conditions, making this product suitable for outdoor and industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers corrosion resistance and reliable electrical connections, ensuring long-term performance and durability.

Terminal Position: DUAL

The dual terminal position provides redundancy and ensures reliable connections, improving the overall robustness and reliability of the product.

No. of Ports: 2

Having 2 ports allows for multiple input/output connections, increasing the versatility and functionality of this product in various applications.

Maximum Seated Height: 2.05 mm

The low maximum seated height of 2.05 mm saves space on the PCB, making this product ideal for applications where board height is a constraint.

Width: 5.275 mm

The compact width of 5.275 mm allows for efficient board layout and space utilization, making this product suitable for small electronic devices and systems.

Output Polarity: TRUE

The true output polarity simplifies signal processing and interpretation, ensuring compatibility with other components and systems without the need for additional conversion circuitry.

Minimum Supply Voltage (Vsup): 4.5 V

The low minimum supply voltage of 4.5 V ensures operation in low-power scenarios, making this product energy-efficient and suitable for battery-operated devices.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, this product can withstand high-temperature reflow soldering processes, ensuring reliable and robust solder joints during manufacturing.

Length: 12.575 mm

The compact length of 12.575 mm allows for space-saving installation on the PCB, making this product suitable for applications with limited board space.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environments and industrial settings, making this product suitable for demanding applications.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, making it efficient and reliable for various electronic applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure mechanical and electrical connections, ensuring stable performance and reliability in demanding operating conditions.

Packing Method: TR

The TR packing method offers convenient handling and storage of multiple units, simplifying inventory management and assembly processes.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for easy soldering and connection to PCBs, ensuring quick and reliable assembly of electronic circuits and systems.

Control Type: ENABLE LOW

The enable low control type simplifies the interface with other components and systems, allowing for easy integration and operation in various electronic applications.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5 V ensures reliable operation within the specified voltage range, protecting the product from potential damage due to overvoltage conditions.

Technical Specifications

Bus Driver & Transceivers MC74VHCT244AMEL attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

AHCT/VHCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.575 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

9.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC74VHCT244AMEL Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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