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MC74VHCT139ADTR2

Onsemi

MC74VHCT139ADTR2 by Onsemi

MC74VHCT139ADTR2 by Onsemi is a CMOS Decoder & Drivers with 10.5ns Propagation Delay, 16.5ns tpd, and 8A I (ol). It operates at -55 to 125 °C, suitable for military applications requiring fast signal processing in compact spaces.

Median Price

$0.134

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

$0.119

1k+ parts

$0.099

10k+ parts

$0.088

5,000

-

$0.119

$0.099

$0.088

DigiKey

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.150

5,000

-

-

-

$0.150

Distributors (In-Stock)

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Digiode

USA . 979 parts In-Stock

1+ parts

$0.093

100+ parts

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979

$0.093

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DigiKey Marketplace

USA . 5,000 parts In-Stock

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5,000

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Vyrian

USA . 3,657 parts In-Stock

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3,657

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R&J Components

USA . 2,500 parts In-Stock

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2,500

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Distributors (Availability)

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Corphita

USA . 2,354 parts In-Stock

1+ parts

$0.088

100+ parts

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2,354

$0.088

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Corohmni

South Africa . 328 parts In-Stock

1+ parts

$0.090

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328

$0.090

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AZTECH Wire

Italy . 39 parts In-Stock

1+ parts

$12.970

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39

$12.970

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QUARKTWIN TECHNOLOGY LTD

USA . 12,725 parts In-Stock

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12,725

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Problanco Electronics

Mexico . 8,357 parts In-Stock

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8,357

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SupplyDigital Components

Austria . 7,457 parts In-Stock

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TANS Electronics

Latvia . 5,760 parts In-Stock

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5,760

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Continental Prestige Electronics

USA . 5,000 parts In-Stock

1+ parts

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$0.084

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5,000

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$0.084

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Microchip USA

USA . 4,185 parts In-Stock

1+ parts

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4,185

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Kulean Microsystems

USA . 2,468 parts In-Stock

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2,468

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UHIMA Technologies

Türkiye . 298 parts In-Stock

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298

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Overview

Experience the innovation and reliability of Onsemi with the MC74VHCT139ADTR2 Decoder & Drivers. This high-quality product offers customers unparalleled performance and versatility for a wide range of applications. With a compact design and advanced technology, this decoder provides fast propagation delay and efficient power supplies, making it a top choice for your electronic projects. Trust Onsemi to deliver cutting-edge solutions that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the body provides durability and protection for the internal components of the decoder & drivers.

Propagation Delay At Nominal Supply: 10.5 ns

The low propagation delay ensures quick response times and efficient operation of the decoder & drivers.

Surface Mount: YES

Being surface mountable makes it easier to integrate the decoder & drivers onto circuit boards, reducing assembly time and footprint.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources and simplifies power management.

Power Supplies (V): 5

Having a power supply voltage of 5V ensures stable and reliable operation of the decoder & drivers.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the decoder & drivers to be used in a wide range of environmental conditions without risk of overheating.

Technology: CMOS

The CMOS technology used in the decoder & drivers ensures low power consumption and compatibility with a variety of digital systems.

Technical Specifications

Decoder & Drivers MC74VHCT139ADTR2 attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

AHCT/VHCT

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

16.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

MC74VHCT139ADTR2 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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