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MC74VHCT126AMG

Onsemi

MC74VHCT126AMG by Onsemi

MC74VHCT126AMG by Onsemi is a 4-function bus driver with 8.5ns propagation delay at 5V supply, suitable for industrial applications. It features 3-STATE output, operates b/w -40 to 85 °C, and has a small outline package style. The device supports surface mount installation and has a max seated height of 2.05mm.

Median Price

$0.384

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 24,750 parts In-Stock

1+ parts

-

100+ parts

$0.370

1k+ parts

$0.307

10k+ parts

$0.274

24,750

-

$0.370

$0.307

$0.274

DigiKey

USA . 24,750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.460

10k+ parts

-

24,750

-

-

$0.460

-

Verical

USA . 24,750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.384

10k+ parts

$0.342

24,750

-

-

$0.384

$0.342

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,841 parts In-Stock

1+ parts

$0.288

100+ parts

-

1k+ parts

-

10k+ parts

-

1,841

$0.288

-

-

-

Vyrian

USA . 3,116 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,116

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,147 parts In-Stock

1+ parts

$0.273

100+ parts

-

1k+ parts

-

10k+ parts

-

1,147

$0.273

-

-

-

Corohmni

South Africa . 236 parts In-Stock

1+ parts

$0.303

100+ parts

-

1k+ parts

-

10k+ parts

-

236

$0.303

-

-

-

Component Stockers USA

USA . 36,584 parts In-Stock

1+ parts

$0.310

100+ parts

$0.290

1k+ parts

$0.260

10k+ parts

$0.260

36,584

$0.310

$0.290

$0.260

$0.260

AZTECH Wire

Italy . 373 parts In-Stock

1+ parts

$11.530

100+ parts

-

1k+ parts

-

10k+ parts

-

373

$11.530

-

-

-

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$19.922

100+ parts

$18.129

1k+ parts

$16.336

10k+ parts

-

500

$19.922

$18.129

$16.336

-

Continental Prestige Electronics

USA . 24,750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.263

10k+ parts

-

24,750

-

-

$0.263

-

Kulean Microsystems

USA . 7,573 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,573

-

-

-

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TANS Electronics

Latvia . 2,904 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,904

-

-

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SupplyDigital Components

Austria . 1,615 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,615

-

-

-

-

Problanco Electronics

Mexico . 895 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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895

-

-

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UHIMA Technologies

Türkiye . 353 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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353

-

-

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Microchip USA

USA . 186 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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186

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Overview

Unlock the power of seamless data transmission with the MC74VHCT126AMG by Onsemi. Crafted with precision and expertise, this bus driver & transceiver offers unparalleled quality and reliability. Ideal for a wide range of applications, this product provides fast propagation delay, 3-state output characteristics, and true output polarity. Experience the value and benefits of this small outline package with dual terminals that ensure optimal performance in industrial settings. Trust Onsemi to deliver superior technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the product durable and resistant to damage, ensuring long-lasting performance.

Propagation Delay At Nominal Supply: 8.5 ns

Low propagation delay ensures fast and efficient data transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V makes this product compatible with various electronic systems and circuits.

Output Characteristics: 3-STATE

3-state output allows for versatile control of connected devices, offering flexibility in system design.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Technical Specifications

Bus Driver & Transceivers MC74VHCT126AMG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY

Control Type:

ENABLE HIGH

Family:

AHCT/VHCT/VT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC74VHCT126AMG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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