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MC74VHCT126AMEL

Onsemi

MC74VHCT126AMEL by Onsemi

MC74VHCT126AMEL by Onsemi is a 4-function bus driver with 8.5ns propagation delay at 5V supply, suitable for industrial applications. It features 3-STATE output characteristics, operates b/w -40 to 85 °C, and has a small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,802 parts In-Stock

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Digiode

USA . 1,281 parts In-Stock

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AZTECH Wire

Italy . 748 parts In-Stock

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$16.470

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Component Stockers USA

USA . 246 parts In-Stock

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$99.990

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SupplyDigital Components

Austria . 7,514 parts In-Stock

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Problanco Electronics

Mexico . 5,083 parts In-Stock

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TANS Electronics

Latvia . 4,836 parts In-Stock

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Kulean Microsystems

USA . 3,223 parts In-Stock

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UHIMA Technologies

Türkiye . 605 parts In-Stock

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Microchip USA

USA . 400 parts In-Stock

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Corohmni

South Africa . 354 parts In-Stock

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Corphita

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Overview

Unlock the power of seamless communication with the MC74VHCT126AMEL by Onsemi. Designed with precision and expertise, this bus driver & transceiver offers unparalleled reliability and performance. Ideal for a wide range of applications, this product is perfect for those who value efficiency and quality in their projects. Elevate your designs with the advanced features and benefits that this product has to offer. Trust Onsemi to deliver cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the bus driver & transceivers.

Propagation Delay At Nominal Supply: 8.5 ns

The low propagation delay ensures fast and efficient signal transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

Being surface mountable, this product offers ease of installation and saves space on the PCB, making it ideal for compact designs.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage is commonly used in many electronic systems, ensuring compatibility with a wide range of devices.

Output Characteristics: 3-STATE

The 3-STATE output characteristic allows the bus driver & transceivers to disconnect from the bus line when in the high-impedance state, preventing signal interference and improving the overall network performance.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high noise immunity, making this product energy-efficient and reliable for long-term operation.

Technical Specifications

Bus Driver & Transceivers MC74VHCT126AMEL attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY

Control Type:

ENABLE HIGH

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC74VHCT126AMEL Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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