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MC74VHCT125ADTRG

Onsemi

MC74VHCT125ADTRG by Onsemi

MC74VHCT125ADTRG by Onsemi is a 4-function bus driver with 10.5ns propagation delay at 5V, suitable for military-grade applications. It features a 3-STATE output, operates b/w -55 to 125 °C, and has a max I (ol) of 8A. The package is small outline with dual terminals and nickel palladium gold finish, making it ideal for compact designs requiring fast signal transmission.

Median Price

$0.180

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 241,877 parts In-Stock

1+ parts

$0.180

100+ parts

$0.180

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$0.170

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241,877

$0.180

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$0.170

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Mouser Electronics

USA . 329 parts In-Stock

1+ parts

$0.960

100+ parts

$0.382

1k+ parts

$0.259

10k+ parts

$0.179

329

$0.960

$0.382

$0.259

$0.179

Arrow

USA . 25,000 parts In-Stock

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-

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$0.156

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$0.156

Verical

USA . 7,500 parts In-Stock

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$0.156

7,500

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$0.156

Chip1Stop

Japan . 2,339 parts In-Stock

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-

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$0.203

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$0.165

10k+ parts

$0.148

2,339

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$0.203

$0.165

$0.148

Distributors (In-Stock)

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Digiode

USA . 384 parts In-Stock

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$0.147

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384

$0.147

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Nova Conductors

Japan . 870 parts In-Stock

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$0.259

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870

$0.259

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TME

Poland . 65 parts In-Stock

1+ parts

$0.520

100+ parts

$0.277

1k+ parts

$0.255

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65

$0.520

$0.277

$0.255

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Maritex

Poland . 229 parts In-Stock

1+ parts

$0.622

100+ parts

$0.332

1k+ parts

$0.315

10k+ parts

$0.285

229

$0.622

$0.332

$0.315

$0.285

Chip Stock

USA . 6,650 parts In-Stock

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Vyrian

USA . 6,470 parts In-Stock

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NAC Semi

USA . 2,500 parts In-Stock

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$0.539

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$0.539

Inventory MP

USA . 2,312 parts In-Stock

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Bristol Electronics

USA . 2,312 parts In-Stock

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Velocity Electronics

USA . 904 parts In-Stock

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904

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Speed Components Ltd

Israel . 50 parts In-Stock

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50

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Distributors (Availability)

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Ampacity Inc.

Singapore . 4,164 parts In-Stock

1+ parts

$0.120

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$0.120

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Corphita

USA . 618 parts In-Stock

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$0.140

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618

$0.140

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Corohmni

South Africa . 184 parts In-Stock

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$0.155

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184

$0.155

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Netroflash

USA . 100 parts In-Stock

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$0.259

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$0.246

10k+ parts

$0.241

100

$0.259

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$0.246

$0.241

Component Stockers USA

USA . 31,189 parts In-Stock

1+ parts

$0.600

100+ parts

$0.310

1k+ parts

$0.190

10k+ parts

$0.180

31,189

$0.600

$0.310

$0.190

$0.180

Continental Prestige Electronics

USA . 78 parts In-Stock

1+ parts

$0.622

100+ parts

$0.320

1k+ parts

$0.210

10k+ parts

$0.171

78

$0.622

$0.320

$0.210

$0.171

Microchip USA

USA . 5,494 parts In-Stock

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$1.533

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RC Electronics

USA . 68,548 parts In-Stock

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Perfect Parts

USA . 33,861 parts In-Stock

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TANS Electronics

Latvia . 6,892 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,666 parts In-Stock

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Lixinc

USA . 5,875 parts In-Stock

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Problanco Electronics

Mexico . 5,772 parts In-Stock

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iodParts Technologies Inc.

India . 4,817 parts In-Stock

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Kulean Microsystems

USA . 4,460 parts In-Stock

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SupplyDigital Components

Austria . 1,426 parts In-Stock

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Assy Fe

Spain . 1,023 parts In-Stock

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Kepictronics

USA . 630 parts In-Stock

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UHIMA Technologies

Türkiye . 296 parts In-Stock

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Overview

Discover the unparalleled quality and reliability of the MC74VHCT125ADTRG by Onsemi, a leading manufacturer in the industry. This bus driver and transceiver is designed to deliver superior performance and efficiency in a wide range of applications. With its advanced technology and innovative design, this product offers customers unmatched value, benefits, and advantages. Experience seamless operation and enhanced functionality with the MC74VHCT125ADTRG, setting new standards for excellence in the field.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material for the package body makes the product lightweight and durable, ideal for use in portable devices.

Propagation Delay At Nominal Supply: 10.5 ns

Low propagation delay ensures fast data transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

No. of Functions: 4

Multiple functions within a single component offer increased functionality and versatility in circuit design.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, compatible with most electronic systems and devices.

Load Capacitance (CL): 50 pF

Optimal load capacitance for efficient signal transmission and reception, ensuring reliable performance in various applications.

Power Supplies (V): 5

Stable power supply voltage of 5V ensures consistent and reliable operation of the product.

No. of Terminals: 14

Sufficient number of terminals for easy connectivity and integration in circuit layouts, allowing for flexible design options.

Maximum I (ol): 8 Amp

High output current capacity of 8 Amp enables the product to drive multiple loads simultaneously without overheating or damage.

Propagation Delay (tpd): 16 ns

Low propagation delay of 16 ns contributes to high-speed data transmission and reduced signal latency in communication systems.

Maximum Operating Temperature: 125 °C

Wide operating temperature range of up to 125°C ensures reliable performance in extreme environmental conditions.

Output Characteristics: 3-STATE

3-state output allows for flexible control of the output signal, providing options for high impedance, low level, and high level outputs.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature of -55°C ensures product functionality in cold environments or at start-up conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish ensures reliable electrical connections and resistance to corrosion, extending the product's lifespan.

Terminal Position: DUAL

Dual terminal position offers flexibility in layout design and allows for efficient signal routing in complex circuit configurations.

No. of Ports: 2

Dual ports provide multiple input/output options and enhance connectivity in networking and communication systems.

Maximum Seated Height: 1.2 mm

Low profile design with a maximum seated height of 1.2 mm allows for compact and space-saving integration in electronic devices.

Width: 4.4 mm

Narrow width of 4.4 mm facilitates densely packed circuit board layouts and efficient use of space in electronic assemblies.

Output Polarity: TRUE

True output polarity ensures correct signal alignment and compatibility with other components in the circuit, reducing the risk of errors or malfunctions.

Minimum Supply Voltage (Vsup): 4.5 V

Minimum supply voltage of 4.5V ensures reliable operation even under low power conditions, enhancing product stability and performance.

Maximum Time At Peak Reflow Temperature (s): 30

Product can withstand peak reflow temperatures for up to 30 seconds, making it suitable for automated assembly processes and rework procedures.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C ensures proper soldering and bonding during assembly, maintaining strong connections for reliable performance.

Length: 5 mm

Compact length of 5 mm allows for space-efficient placement on circuit boards and minimizes signal propagation delays for improved system responsiveness.

Temperature Grade: MILITARY

Military-grade temperature rating ensures ruggedness and durability, making the product suitable for harsh operating environments and mission-critical applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, enhancing the product's efficiency and reliability in digital circuits.

Terminal Form: GULL WING

Gull wing terminal form provides secure surface mounting and soldering, ensuring strong mechanical and electrical connections for reliable performance.

Packing Method: TR

TR packing method (Tape and Reel) offers convenient handling and storage during manufacturing, transportation, and assembly processes.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65 mm enables high-density mounting on circuit boards, maximizing interconnection density and reducing overall footprint.

Control Type: ENABLE LOW

Enable low control type provides easy integration with digital control signals, allowing for simple and efficient operation in automated systems.

Maximum Supply Voltage (Vsup): 5.5 V

Maximum supply voltage rating of 5.5V ensures protection against voltage spikes or fluctuations, safeguarding the product from damage or malfunction.

Maximum Power Supply Current (ICC): 1.65 mA

Low power supply current consumption of 1.65 mA minimizes energy usage and heat dissipation, making the product energy-efficient and cost-effective.

Technical Specifications

Bus Driver & Transceivers MC74VHCT125ADTRG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

AHCT/VHCT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

1.65 mA

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

MC74VHCT125ADTRG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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