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MC74VHCT125ADTR2

Onsemi

MC74VHCT125ADTR2 by Onsemi

MC74VHCT125ADTR2 by Onsemi is a 4-function bus driver with 10.5ns propagation delay at 5V, suitable for military-grade applications. It features a max I (ol) of 8A, TRUE output polarity, and operates b/w -55 to 125 °C. The package style is small outline with dual terminal position and nickel/palladium/gold finish.

Median Price

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Lifecycle Status

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4

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1k+

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Vyrian

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ACDS - Activité Composants Distribution Service

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Digiode

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Semi Source

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AZTECH Wire

Italy . 623 parts In-Stock

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Perfect Parts

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Problanco Electronics

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TANS Electronics

Latvia . 3,216 parts In-Stock

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Cyclops Electronics Ltd (Excess)

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Glotronic Ltd.

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Assy Fe

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SupplyDigital Components

Austria . 1,305 parts In-Stock

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South Africa . 455 parts In-Stock

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Corphita

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Microchip USA

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Kulean Microsystems

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UHIMA Technologies

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Overview

Unlock the power of seamless data transmission with the MC74VHCT125ADTR2 by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers high-quality bus drivers and transceivers that cater to a wide range of applications. Elevate your projects with this innovative product that offers reliable performance, efficiency, and versatility. Whether you're designing for industrial automation or consumer electronics, the MC74VHCT125ADTR2 provides exceptional value and benefits that will exceed your expectations. Trust Onsemi to take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus driver/transceiver.

Propagation Delay At Nominal Supply: 10.5 ns

Low propagation delay ensures fast and efficient data transmission.

Surface Mount: YES

Allows for easy and convenient PCB assembly.

No. of Functions: 4

Offers versatility and multiple functions in a single device.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard supply voltage for compatibility with other components.

Load Capacitance (CL): 50 pF

Optimized for efficient performance with a specific load capacitance.

Output Characteristics: 3-STATE

Allows the device to have three output states, providing flexibility in controlling connected devices.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Temperature Grade: MILITARY

Designed to operate reliably in harsh temperature conditions typically found in military applications.

Technical Specifications

Bus Driver & Transceivers MC74VHCT125ADTR2 attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

AHCT/VHCT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

1.65 mA

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4.4 mm

Trade Compliance

MC74VHCT125ADTR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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