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MC74VHC573MEL

Onsemi

MC74VHC573MEL by Onsemi

MC74VHC573MEL by Onsemi is an 8-bit bus driver with 10ns propagation delay, operating at 3.3V. It features a 17.5ns propagation delay, 50pF load capacitance, and supports a supply voltage range of 2-5.5V. Ideal for industrial applications requiring true output polarity and 3-state output characteristics in a small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 8,764 parts In-Stock

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Digiode

USA . 1,972 parts In-Stock

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AZTECH Wire

Italy . 941 parts In-Stock

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$9.880

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QUARKTWIN TECHNOLOGY LTD

USA . 22,307 parts In-Stock

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TANS Electronics

Latvia . 6,881 parts In-Stock

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SupplyDigital Components

Austria . 6,441 parts In-Stock

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Problanco Electronics

Mexico . 5,690 parts In-Stock

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Kulean Microsystems

USA . 3,241 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 818 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 89 parts In-Stock

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Overview

Enhance the performance of your electronics with the MC74VHC573MEL by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Bus Driver & Transceivers that are essential for seamless data transmission and communication. With a nominal supply voltage of 3.3V and a propagation delay of only 10ns, this product ensures fast and reliable operation. Whether used in industrial automation, telecommunications, or consumer electronics, the MC74VHC573MEL offers unmatched value, efficiency, and precision. Upgrade your system today with this innovative solution from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This makes the product lightweight and durable, ideal for use in various applications.

Propagation Delay At Nominal Supply: 10 ns

Low propagation delay ensures fast and efficient data transmission in the bus system.

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving time and effort.

Nominal Supply Voltage / Vsup (V): 3.3

Operates efficiently at a standard supply voltage, ensuring compatibility with many systems.

Load Capacitance (CL): 50 pF

Suitable for driving loads with low capacitance, ensuring reliable signal transmission.

Power Supplies (V): 2/5.5

Wide range of power supply options allows flexibility in system design and compatibility.

Maximum I (ol): 8 Amp

Capable of providing high output current, suitable for driving heavy loads.

Output Characteristics: 3-STATE

Ability to set the output to high impedance state allows for bus sharing and isolation.

Temperature Grade: INDUSTRIAL

Can operate reliably in industrial temperature range, making it suitable for harsh environments.

Technical Specifications

Bus Driver & Transceivers MC74VHC573MEL attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.575 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

10 ns

Propagation Delay (tpd):

17.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC74VHC573MEL Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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