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MC74VHC1GT126MU2TCG

Onsemi

MC74VHC1GT126MU2TCG by Onsemi

MC74VHC1GT126MU2TCG by Onsemi is a 3-STATE bus driver with 6 terminals, operating at -55 to 125 °C. It has a propagation delay of 16 ns and can handle a load capacitance of 50 pF. Ideal for applications requiring true output polarity and enable high control type in small outline packages.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 4,691 parts In-Stock

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Digiode

USA . 662 parts In-Stock

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Nova Conductors

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AZTECH Wire

Italy . 593 parts In-Stock

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$8.680

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Ampacity Inc.

Singapore . 169 parts In-Stock

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Problanco Electronics

Mexico . 8,031 parts In-Stock

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SupplyDigital Components

Austria . 6,379 parts In-Stock

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TANS Electronics

Latvia . 6,069 parts In-Stock

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Continental Prestige Electronics

USA . 3,767 parts In-Stock

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Argo Parts USA

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Corphita

USA . 1,824 parts In-Stock

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Kulean Microsystems

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UHIMA Technologies

Türkiye . 697 parts In-Stock

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Corohmni

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Microchip USA

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Overview

Unleash the power of seamless data transmission with the MC74VHC1GT126MU2TCG by Onsemi. Crafted with precision and expertise, this bus driver & transceiver offers unparalleled quality and reliability. Perfect for a range of applications, this product truly stands out in its category. Elevate your projects with the value, benefits, and advantages that only Onsemi can provide. Say goodbye to communication barriers and hello to effortless connectivity with the MC74VHC1GT126MU2TCG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring a long lifespan.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and simplifying assembly.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used and fits well in most electronic designs, providing compatibility and versatility.

Nominal Supply Voltage: 3V

The 3V supply voltage is a standard rating that is commonly used, ensuring compatibility with a wide range of systems and applications.

Output Characteristics: 3-STATE

The 3-STATE output characteristic allows for high flexibility in controlling the output signals, making it suitable for various bus driver and transceiver applications.

Technology: CMOS

Being built with CMOS technology, this product offers low power consumption and high noise immunity, making it energy-efficient and reliable in data transmission.

Technical Specifications

Bus Driver & Transceivers MC74VHC1GT126MU2TCG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE HIGH

Count Direction:

UNIDIRECTIONAL

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-N6

Length:

1.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay (tpd):

16 ns

Maximum Seated Height:

.55 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1 mm

Trade Compliance

MC74VHC1GT126MU2TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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