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MC74LVXC3245DWRG

Onsemi

MC74LVXC3245DWRG by Onsemi

MC74LVXC3245DWRG by Onsemi is an 8-bit bus driver with 3V & 3/5V translation. It has a propagation delay of 9ns, operates at a nominal voltage of 3.3V, and supports common control applications. Ideal for bidirectional communication systems requiring fast signal transmission in industrial environments.

Median Price

$0.844

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 341 parts In-Stock

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$0.844

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$0.793

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$0.717

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Arrow

USA . 98 parts In-Stock

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$1.691

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$0.742

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Verical

USA . 98 parts In-Stock

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Digiode

USA . 1,015 parts In-Stock

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$0.802

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$0.802

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DF Sales Co.

USA . 24 parts In-Stock

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$2.280

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DF Sales Co.

USA . 24 parts In-Stock

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Chip Stock

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Vyrian

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Nova Conductors

Japan . 500 parts In-Stock

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Ampacity Inc.

Singapore . 179 parts In-Stock

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$0.630

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179

$0.630

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Semicontronic

India . 179 parts In-Stock

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$0.630

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$0.614

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$0.611

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Corohmni

South Africa . 391 parts In-Stock

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$0.742

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Corphita

USA . 427 parts In-Stock

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$0.760

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AZTECH Wire

Italy . 735 parts In-Stock

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$13.732

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735

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$14.022

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$12.760

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$11.498

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Aztec Data Supply Inc.

USA . 902 parts In-Stock

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$22.550

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Perfect Parts

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Lixinc

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Problanco Electronics

Mexico . 7,543 parts In-Stock

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TANS Electronics

Latvia . 7,148 parts In-Stock

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Authorized Procurement Solutions

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Kepictronics

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Continental Prestige Electronics

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iodParts Technologies Inc.

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Kulean Microsystems

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Argo Parts USA

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Aranea Global

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Microchip USA

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UHIMA Technologies

Türkiye . 396 parts In-Stock

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SupplyDigital Components

Austria . 68 parts In-Stock

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Overview

Unlock seamless data communication with the MC74LVXC3245DWRG by Onsemi. Crafted with precision and expertise, Onsemi's bus driver & transceivers category guarantees top-notch quality, reliability, and performance. Ideal for a wide range of applications, this product offers unparalleled value with its efficient translation capabilities, quick propagation delay, and versatile supply voltage options. Say goodbye to communication barriers and hello to smooth data transmission with Onsemi's MC74LVXC3245DWRG. Elevate your projects with the best in the business.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for packaging, ensuring reliability and affordability.

Propagation Delay At Nominal Supply: 9 ns

Fast propagation delay allows for efficient data transmission.

Surface Mount: YES

Easy to integrate onto circuit boards for streamlined manufacturing process.

Package Shape: RECTANGULAR

Space-efficient design for compact layout on PCBs.

No. of Bits: 8

Suitable for a wide range of data processing applications.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with common supply voltages, simplifying power requirements.

Power Supplies (V): 2.5/3.3,3.3/5

Supports multiple power supply configurations for flexibility in system design.

Maximum I (ol): 24 Amp

High output current capability for driving various loads.

Output Characteristics: 3-STATE

Allows for tristate outputs, enabling bus sharing and multi-drop configurations.

Minimum Operating Temperature: -40 °C

Wide operating temperature range suitable for industrial environments.

Technology: CMOS

Low power consumption and high noise immunity characteristics of CMOS technology.

Technical Specifications

Bus Driver & Transceivers MC74LVXC3245DWRG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Additional Features:

3.3V SUPPLY FOR PORT A; 5V SUPPLY FOR PORT B

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e3

Length:

15.395 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3,3.3/5

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

3V & 3/5V

Width:

7.5 mm

Trade Compliance

MC74LVXC3245DWRG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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