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MC74LVX8051DTG

Onsemi

MC74LVX8051DTG by Onsemi

MC74LVX8051DTG by Onsemi is a CMOS single-ended multiplexer with 8 channels. It operates at a supply voltage range of 2.5-6V and offers a max on-state resistance of 50 ohm. Ideal for military-grade applications requiring high-speed switching with low power consumption.

Median Price

$0.392

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 576 parts In-Stock

1+ parts

$0.740

100+ parts

$0.402

1k+ parts

$0.398

10k+ parts

$0.312

576

$0.740

$0.402

$0.398

$0.312

Rochester

USA . 7,968 parts In-Stock

1+ parts

-

100+ parts

$0.378

1k+ parts

$0.314

10k+ parts

$0.280

7,968

-

$0.378

$0.314

$0.280

Verical

USA . 7,968 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.392

10k+ parts

$0.350

7,968

-

-

$0.392

$0.350

Distributors (In-Stock)

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Digiode

USA . 379 parts In-Stock

1+ parts

$0.808

100+ parts

-

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379

$0.808

-

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Flip Electronics

USA . 8,736 parts In-Stock

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8,736

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Vyrian

USA . 2,321 parts In-Stock

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2,321

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Distributors (Availability)

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Corphita

USA . 1,101 parts In-Stock

1+ parts

$0.765

100+ parts

-

1k+ parts

-

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1,101

$0.765

-

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Corohmni

South Africa . 109 parts In-Stock

1+ parts

$0.850

100+ parts

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109

$0.850

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SupplyDigital Components

Austria . 6,752 parts In-Stock

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6,752

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Kulean Microsystems

USA . 6,644 parts In-Stock

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6,644

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Problanco Electronics

Mexico . 3,761 parts In-Stock

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3,761

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TANS Electronics

Latvia . 1,017 parts In-Stock

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1,017

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UHIMA Technologies

Türkiye . 389 parts In-Stock

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389

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Overview

Upgrade your electronics with the MC74LVX8051DTG from Onsemi, a leading manufacturer in the industry. This versatile multiplexer offers high-quality performance and reliability, making it perfect for a wide range of applications. With its compact design and advanced technology, this product provides value and benefits that are unmatched. Experience seamless switching and enhanced functionality with the MC74LVX8051DTG, setting new standards in electronic components.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the multiplexer, ensuring a longer lifespan.

Nominal Supply Voltage (Vsup): 3 V

Optimal supply voltage for efficient operation of the multiplexer.

No. of Channels: 8

Allows for versatile signal routing and switching options, making it suitable for a variety of applications.

Surface Mount: YES

Facilitates easy installation and PCB integration, saving time and effort in the assembly process.

Maximum Operating Temperature: 125 °C

Ensures reliable operation even in high-temperature environments, making it suitable for industrial or automotive applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of supply voltages.

Technical Specifications

Multiplexers & Switches MC74LVX8051DTG attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

8

No. of Functions:

1

No. of Terminals:

16

Nominal Off-state Isolation:

37 dB

Nominal On-state Resistance Match:

25 ohm

Maximum On-state Resistance (Ron):

50 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/6

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Signal Current:

.02 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.16 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Maximum Switch-off Time:

30 ns

Maximum Switch-on Time:

15 ns

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

MC74LVX8051DTG Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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