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MC74HC4053ADWR2G

Onsemi

MC74HC4053ADWR2G by Onsemi

MC74HC4053ADWR2G by Onsemi is a CMOS multiplexer with 3 functions, 16 terminals, and 80 ohm on-state resistance. It operates b/w -55 to 125 °C and is ideal for military-grade applications requiring small outline packages and low power consumption.

Median Price

$0.519

Lifecycle Status

Suppliers In-Stock

23

In-Stock Inventory

1k+

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Mouser Electronics

USA . 4,584 parts In-Stock

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$0.630

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Adafruit Industries

USA . 270 parts In-Stock

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Rochester

USA . 20,961 parts In-Stock

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$0.500

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$0.415

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DigiKey

USA . 20,961 parts In-Stock

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Verical

USA . 5,142 parts In-Stock

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Future Electronics

Canada . 1,000 parts In-Stock

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Chip1Stop

Japan . 1,000 parts In-Stock

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Element14

Singapore . 820 parts In-Stock

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$0.685

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$0.575

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Farnell

UK . 817 parts In-Stock

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Digiode

USA . 1,972 parts In-Stock

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Flip Electronics

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Vyrian

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Dan-Mar Components

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Lantek

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Connect4Technologies Inc.

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Mil-Aero Solutions, Inc.

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ACDS - Activité Composants Distribution Service

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PC Components Company LLC

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Bristol Electronics

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Sea View Technologies

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Atlantic Semiconductor

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Nova Conductors

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Semicontronic

India . 3,510 parts In-Stock

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$0.315

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$0.307

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$0.306

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Ampacity Inc.

Singapore . 3,504 parts In-Stock

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Corphita

USA . 433 parts In-Stock

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Corohmni

South Africa . 63 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,036 parts In-Stock

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$7.955

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Advanced Electronics

New Zealand . 270 parts In-Stock

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Continental Prestige Electronics

USA . 28,962 parts In-Stock

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Perfect Parts

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Lixinc

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SupplyDigital Components

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TANS Electronics

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Kulean Microsystems

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A-Z Elektronik GmbH

Germany . 2,400 parts In-Stock

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Assy Fe

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Argo Parts USA

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GreenTree Electronics

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Bastille Electronics

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Infinite Electronics LLP (Excess)

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UHIMA Technologies

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Overview

Experience the seamless functionality and reliability of the MC74HC4053ADWR2G by Onsemi, a leading manufacturer in the industry. This versatile multiplexer offers exceptional performance and precision for a wide range of applications, making it an essential component for your projects. With its high-quality construction and innovative design, this product guarantees efficient operation and superior results. Elevate your work with the MC74HC4053ADWR2G and enjoy the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, enhancing the overall reliability of the product.

Surface Mount: YES

Surface mount capability allows for easy installation and saves space on the circuit board.

No. of Functions: 3

Having multiple functions in one device offers versatility and efficiency in circuit design.

Nominal Supply Voltage (Vsup): 4.5 V

The nominal supply voltage of 4.5V provides a stable power source for consistent performance.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability in harsh environments and under heavy usage.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, enhancing the efficiency of the device.

Nominal Off-state Isolation: 50 dB

High off-state isolation ensures minimal crosstalk and interference between channels, improving signal integrity.

Technical Specifications

Multiplexers & Switches MC74HC4053ADWR2G attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Additional Features:

ALSO OPERATES WITH 2V TO 12V (VCC-VEE) SUPPLY

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

Maximum Negative Supply Voltage (Vsup):

-6 V

Minimum Negative Supply Voltage (Vsup):

0 V

Nominal Negative Supply Voltage (Vsup):

-4.5 V

No. of Channels:

2

No. of Functions:

3

No. of Terminals:

16

Nominal Off-state Isolation:

50 dB

Nominal On-state Resistance Match:

12 ohm

Maximum On-state Resistance (Ron):

80 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6,GND/-6

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Signal Current:

.025 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.08 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Maximum Switch-off Time:

160 ns

Maximum Switch-on Time:

245 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.5 mm

Trade Compliance

MC74HC4053ADWR2G Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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