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MC74LVX245DWR2G

Onsemi

MC74LVX245DWR2G by Onsemi

MC74LVX245DWR2G by Onsemi is an 8-bit bus driver with a propagation delay of 11.5 ns at 3.3V, suitable for bidirectional control applications. It features a small outline package style, operates in industrial temperature range (-40 to 85°C), and supports common control with dual terminal position.

Median Price

$0.621

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 143 parts In-Stock

1+ parts

$1.040

100+ parts

$0.599

1k+ parts

$0.518

10k+ parts

$0.476

143

$1.040

$0.599

$0.518

$0.476

Rochester

USA . 38,419 parts In-Stock

1+ parts

-

100+ parts

$0.598

1k+ parts

$0.496

10k+ parts

$0.443

38,419

-

$0.598

$0.496

$0.443

Verical

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.621

10k+ parts

$0.553

15,000

-

-

$0.621

$0.553

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,612 parts In-Stock

1+ parts

$0.465

100+ parts

-

1k+ parts

-

10k+ parts

-

1,612

$0.465

-

-

-

Bristol Electronics

USA . 635 parts In-Stock

1+ parts

$1.162

100+ parts

$0.430

1k+ parts

$0.325

10k+ parts

-

635

$1.162

$0.430

$0.325

-

Flip Electronics

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

-

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12,000

-

-

-

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Vyrian

USA . 5,228 parts In-Stock

1+ parts

-

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5,228

-

-

-

-

Zilex Electronics Inc.

Canada . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,000

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 635 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

635

-

-

-

-

Dan-Mar Components

USA . 635 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

635

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,924 parts In-Stock

1+ parts

$0.440

100+ parts

-

1k+ parts

-

10k+ parts

-

1,924

$0.440

-

-

-

Corohmni

South Africa . 260 parts In-Stock

1+ parts

$0.489

100+ parts

-

1k+ parts

-

10k+ parts

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260

$0.489

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 13,194 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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13,194

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-

-

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SupplyDigital Components

Austria . 6,950 parts In-Stock

1+ parts

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6,950

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-

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Kulean Microsystems

USA . 3,807 parts In-Stock

1+ parts

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3,807

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Problanco Electronics

Mexico . 3,669 parts In-Stock

1+ parts

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3,669

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-

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TANS Electronics

Latvia . 2,165 parts In-Stock

1+ parts

-

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2,165

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Perfect Parts

USA . 1,716 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,716

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-

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UHIMA Technologies

Türkiye . 257 parts In-Stock

1+ parts

-

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257

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Metaverse IC Inc.

Canada . 200 parts In-Stock

1+ parts

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200

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Kepictronics

USA . 100 parts In-Stock

1+ parts

-

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100

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-

Overview

Unlock unparalleled performance and reliability with the MC74LVX245DWR2G by Onsemi, a leading manufacturer in the industry. This bus driver & transceiver boasts exceptional quality and versatility, making it ideal for a wide range of applications. With a compact design and advanced technology, this product delivers unmatched value, benefits, and advantages to customers. Upgrade your projects today with the MC74LVX245DWR2G and experience seamless operation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 11.5 ns

Low propagation delay allows for fast and efficient signal transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

Surface mount technology makes installation easier and more convenient, saving time and effort during assembly.

No. of Bits: 8

Suitable for handling 8-bit data transmission, which is common in many bus driver applications.

Nominal Supply Voltage / Vsup (V): 2.7

Operates at a low supply voltage, making it energy-efficient and cost-effective in the long run.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments where heat dissipation is crucial.

Output Characteristics: 3-STATE

3-state output allows for flexible and efficient bus control, enabling multiple devices to share the same bus line without interference.

Technology: CMOS

CMOS technology offers low power consumption and fast switching speeds, ideal for bus drivers and transceivers.

Technical Specifications

Bus Driver & Transceivers MC74LVX245DWR2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

11.5 ns

Propagation Delay (tpd):

17 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

MC74LVX245DWR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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