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MC74LCX573MG

Onsemi

MC74LCX573MG by Onsemi

MC74LCX573MG by Onsemi is an 8-bit bus driver with 3-STATE output, operating at a supply voltage of 2.5V to 3.6V. It features a propagation delay of 8 ns, making it suitable for applications requiring fast data transmission in industrial settings. With a compact small outline package and dual terminal position, it offers efficient surface-mount installation for various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,584 parts In-Stock

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Digiode

USA . 2,446 parts In-Stock

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AZTECH Wire

Italy . 366 parts In-Stock

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$21.710

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366

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TANS Electronics

Latvia . 7,499 parts In-Stock

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SupplyDigital Components

Austria . 6,977 parts In-Stock

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Microchip USA

USA . 3,916 parts In-Stock

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Kulean Microsystems

USA . 1,876 parts In-Stock

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Corphita

USA . 927 parts In-Stock

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Problanco Electronics

Mexico . 606 parts In-Stock

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Corohmni

South Africa . 481 parts In-Stock

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UHIMA Technologies

Türkiye . 224 parts In-Stock

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Overview

Enhance your electronic projects with the MC74LCX573MG by Onsemi, a top-tier bus driver & transceiver that offers unparalleled quality and reliability. Manufactured by Onsemi, a renowned industry leader, this product boasts a range of applications in various fields. From its efficient design to its high-performance features, the MC74LCX573MG provides exceptional value and benefits to customers seeking superior connectivity solutions. Trust Onsemi to deliver cutting-edge technology that exceeds expectations and elevates your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and protection for the components inside, making the product long-lasting and reliable.

Propagation Delay At Nominal Supply: 8 ns

Low propagation delay ensures fast signal transmission, making this product suitable for applications requiring quick response times.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and facilitating efficient assembly.

Nominal Supply Voltage / Vsup (V): 2.5

Operates at a low voltage, making it energy efficient and suitable for battery-powered devices.

Output Characteristics: 3-STATE

3-state output allows for high impedance state, which is useful for bus systems where multiple drivers may be connected to the same line.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product suitable for sensitive signal transmission applications.

Technical Specifications

Bus Driver & Transceivers MC74LCX573MG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.575 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

8 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC74LCX573MG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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