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MC74LCX139DT

Onsemi

MC74LCX139DT by Onsemi

MC74LCX139DT by Onsemi is a 2-function decoder with 6.2ns propagation delay and 9.3ns tpd. It operates at Vsup of 2-3.6V, ideal for industrial applications requiring fast signal decoding in compact spaces. The small outline package with 0.65mm pitch makes it suitable for surface mount designs, ensuring efficient performance in temperature ranges from -40 to 85 °C.

Median Price

$0.159

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 31 parts In-Stock

1+ parts

-

100+ parts

$0.159

1k+ parts

$0.132

10k+ parts

$0.117

31

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$0.159

$0.132

$0.117

Distributors (In-Stock)

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Digiode

USA . 89 parts In-Stock

1+ parts

$0.124

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$0.124

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Vyrian

USA . 6,241 parts In-Stock

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Bristol Electronics

USA . 294 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 767 parts In-Stock

1+ parts

$0.117

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767

$0.117

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Corohmni

South Africa . 125 parts In-Stock

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$0.130

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125

$0.130

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Component Stockers USA

USA . 20 parts In-Stock

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$0.130

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20

$0.130

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AZTECH Wire

Italy . 671 parts In-Stock

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$10.510

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671

$10.510

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Kulean Microsystems

USA . 5,358 parts In-Stock

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SupplyDigital Components

Austria . 4,616 parts In-Stock

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Problanco Electronics

Mexico . 1,093 parts In-Stock

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TANS Electronics

Latvia . 862 parts In-Stock

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Microchip USA

USA . 381 parts In-Stock

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UHIMA Technologies

Türkiye . 305 parts In-Stock

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Overview

Discover the innovative MC74LCX139DT by Onsemi, a top-quality Decoder & Drivers component designed to enhance your projects. With a fast propagation delay of 6.2ns and superior surface mount technology, this product is ideal for applications requiring precision and efficiency. Onsemi's commitment to excellence ensures reliable performance and seamless integration into your designs. Unlock the value of this versatile component and elevate your projects to new heights with the MC74LCX139DT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the decoder & drivers, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 6.2 ns

Low propagation delay ensures fast response times, making this product suitable for applications requiring quick signal processing.

Surface Mount: YES

Enables easy and secure mounting on a circuit board, saving space and simplifying assembly.

No. of Functions: 2

Having multiple functions in one component increases efficiency and reduces the number of separate components needed for a circuit.

Nominal Supply Voltage / Vsup (V): 2.7

Operates efficiently at a low supply voltage, making it suitable for low-power applications.

Maximum I (ol): 24 Amp

Can handle high output current, making it suitable for driving powerful loads.

Temperature Grade: INDUSTRIAL

Designed to withstand a wide temperature range, making it suitable for industrial applications that may experience varying environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Decoder & Drivers MC74LCX139DT attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

LVC/LCX/Z

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

6.2 ns

Propagation Delay (tpd):

9.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

MC74LCX139DT Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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