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MC74HCT573ANG

Onsemi

MC74HCT573ANG by Onsemi

MC74HCT573ANG by Onsemi is an 8-bit bus driver with 45ns propagation delay at 5V. It features a 3-STATE output and operates in temperatures ranging from -55 °C to 125°C. Ideal for military-grade applications requiring reliable data transmission within a compact package.

Median Price

$0.523

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10,621 parts In-Stock

1+ parts

$0.523

100+ parts

$0.492

1k+ parts

$0.445

10k+ parts

-

10,621

$0.523

$0.492

$0.445

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,937 parts In-Stock

1+ parts

$0.497

100+ parts

-

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1,937

$0.497

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Vyrian

USA . 4,611 parts In-Stock

1+ parts

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4,611

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Carlin Systems, Inc.

USA . 8 parts In-Stock

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8

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Distributors (Availability)

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Corphita

USA . 128 parts In-Stock

1+ parts

$0.471

100+ parts

-

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128

$0.471

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Corohmni

South Africa . 124 parts In-Stock

1+ parts

$0.483

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124

$0.483

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AZTECH Wire

Italy . 194 parts In-Stock

1+ parts

$15.160

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194

$15.160

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Continental Prestige Electronics

USA . 10,621 parts In-Stock

1+ parts

-

100+ parts

$0.417

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10,621

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$0.417

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Problanco Electronics

Mexico . 6,069 parts In-Stock

1+ parts

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6,069

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SupplyDigital Components

Austria . 5,579 parts In-Stock

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5,579

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TANS Electronics

Latvia . 1,846 parts In-Stock

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1,846

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Kulean Microsystems

USA . 1,825 parts In-Stock

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1,825

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UHIMA Technologies

Türkiye . 859 parts In-Stock

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859

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Microchip USA

USA . 412 parts In-Stock

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412

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Overview

Discover the power of seamless data transmission with the MC74HCT573ANG by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and reliability. This 8-bit bus driver & transceiver is versatile and efficient, making it perfect for a wide range of applications. With a fast propagation delay of only 45ns and a maximum operating temperature of 125 °C, this product offers unmatched performance. Trust Onsemi to deliver advanced technology in every component, ensuring that your projects run smoothly and efficiently.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the product lightweight and durable, suitable for use in various environments.

Propagation Delay At Nominal Supply: 45 ns

With a low propagation delay, this product ensures fast and efficient data transmission, making it ideal for high-speed applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes this product compatible with most systems and easy to integrate into existing setups.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow for greater flexibility in controlling the bus signals, making this product versatile for different communication protocols.

Temperature Grade: MILITARY

The MILITARY temperature grade ensures that the product can withstand harsh operating conditions, making it suitable for military and aerospace applications.

Technical Specifications

Bus Driver & Transceivers MC74HCT573ANG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

HCT

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

Length:

26.415 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

45 ns

Propagation Delay (tpd):

45 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.62 mm

Trade Compliance

MC74HCT573ANG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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