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MC74HCT4066ADG

Onsemi

MC74HCT4066ADG by Onsemi

MC74HCT4066ADG by Onsemi is a CMOS SPST switch with 4 functions, Ron of 200 ohm, and isolation of 40 dB. Ideal for military-grade applications requiring fast switching times and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,588 parts In-Stock

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Digiode

USA . 1,024 parts In-Stock

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AZTECH Wire

Italy . 658 parts In-Stock

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$20.730

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658

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Kulean Microsystems

USA . 5,380 parts In-Stock

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SupplyDigital Components

Austria . 4,830 parts In-Stock

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Problanco Electronics

Mexico . 1,146 parts In-Stock

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TANS Electronics

Latvia . 660 parts In-Stock

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Corphita

USA . 282 parts In-Stock

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Corohmni

South Africa . 189 parts In-Stock

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Microchip USA

USA . 108 parts In-Stock

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UHIMA Technologies

Türkiye . 38 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the MC74HCT4066ADG by Onsemi. As a leader in the industry, Onsemi delivers top-quality multiplexers & switches that cater to a wide range of applications. From seamless signal routing to efficient data switching, this product ensures optimal functionality and precision. With its compact design and advanced technology, the MC74HCT4066ADG offers customers unmatched value and versatility. Upgrade your systems today with Onsemi's cutting-edge solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the internal components of the multiplexer, making it a reliable choice for long-term use.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 5 V

The 5V nominal supply voltage is a commonly used standard in many electronic systems, making this multiplexer compatible with a wide range of applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, this multiplexer can withstand harsh environmental conditions and ensure reliable performance in varying temperature settings.

Technology: CMOS

The CMOS technology used in this multiplexer ensures low power consumption and high noise immunity, making it an efficient and reliable choice for electronic systems.

Technical Specifications

Multiplexers & Switches MC74HCT4066ADG attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

0 V

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO

No. of Channels:

1

No. of Functions:

4

No. of Terminals:

14

Nominal Off-state Isolation:

40 dB

Nominal On-state Resistance Match:

30 ohm

Maximum On-state Resistance (Ron):

200 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Signal Current:

.025 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.04 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Maximum Switch-off Time:

45 ns

Maximum Switch-on Time:

37 ns

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.9 mm

Trade Compliance

MC74HCT4066ADG Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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