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MC74HCT374ADWG

Onsemi

MC74HCT374ADWG by Onsemi

MC74HCT374ADWG by Onsemi is an 8-bit bus driver with 3-STATE output, operating at a max frequency of 20MHz. It has a propagation delay of 47ns and can handle a load capacitance of 50pF. Ideal for applications requiring positive edge triggering in military-grade environments.

Median Price

$0.440

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,300 parts In-Stock

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$0.158

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1,300

$0.158

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DigiKey

USA . 408 parts In-Stock

1+ parts

$0.770

100+ parts

$0.473

1k+ parts

$0.385

10k+ parts

$0.347

408

$0.770

$0.473

$0.385

$0.347

Mouser Electronics

USA . 246 parts In-Stock

1+ parts

$0.770

100+ parts

$0.473

1k+ parts

$0.384

10k+ parts

$0.332

246

$0.770

$0.473

$0.384

$0.332

Rochester

USA . 113,155 parts In-Stock

1+ parts

-

100+ parts

$0.424

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$0.352

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$0.314

113,155

-

$0.424

$0.352

$0.314

Verical

USA . 54,454 parts In-Stock

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$0.440

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$0.392

54,454

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$0.440

$0.392

Chip1Stop

Japan . 1,514 parts In-Stock

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1,514

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Distributors (In-Stock)

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Digiode

USA . 1,719 parts In-Stock

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$0.150

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1,719

$0.150

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Vyrian

USA . 7,959 parts In-Stock

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Microfarads

USA . 96 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 355 parts In-Stock

1+ parts

$0.142

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355

$0.142

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Corohmni

South Africa . 264 parts In-Stock

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$0.158

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264

$0.158

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Component Stockers USA

USA . 71,798 parts In-Stock

1+ parts

$0.180

100+ parts

$0.170

1k+ parts

$0.160

10k+ parts

$0.260

71,798

$0.180

$0.170

$0.160

$0.260

SupplyDigital Components

Austria . 4,414 parts In-Stock

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Perfect Parts

USA . 3,455 parts In-Stock

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TANS Electronics

Latvia . 2,035 parts In-Stock

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Kulean Microsystems

USA . 1,668 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 1,200 parts In-Stock

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Problanco Electronics

Mexico . 701 parts In-Stock

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Eastek

USA . 228 parts In-Stock

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GreenTree Electronics

Israel . 228 parts In-Stock

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UHIMA Technologies

Türkiye . 16 parts In-Stock

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Overview

Experience the cutting-edge technology and superior quality of Onsemi with the MC74HCT374ADWG bus driver & transceiver. This compact yet powerful component offers customers seamless integration, exceptional performance, and reliable operation. Ideal for a wide range of applications, this product ensures enhanced efficiency and precision in your projects. Trust Onsemi to deliver unrivaled value and innovation with the MC74HCT374ADWG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the bus driver & transceivers, making it a reliable choice for long-term use.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage ensures compatibility with a wide range of electrical systems, making it versatile for various applications.

Propagation Delay (tpd): 47 ns

The low propagation delay ensures fast and efficient data transmission, making this product ideal for high-speed communication systems.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, increasing its reliability in different settings.

Output Characteristics: 3-STATE

The 3-STATE output allows the bus driver & transceivers to effectively control the flow of data, enhancing the overall performance and efficiency of the system.

Technical Specifications

Bus Driver & Transceivers MC74HCT374ADWG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

47 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Trade Compliance

MC74HCT374ADWG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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