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MC74HC574ANG

Onsemi

MC74HC574ANG by Onsemi

MC74HC574ANG by Onsemi is an 8-bit bus driver with a supply voltage of 3V, operating at temperatures from -55 to 125 °C. It features a propagation delay of 240ns, output polarity TRUE, and supports a max frequency of 20MHz. Ideal for military-grade applications requiring high-speed data transmission in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 8,090 parts In-Stock

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Digiode

USA . 1,384 parts In-Stock

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Semtec, LLC

USA . 205 parts In-Stock

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QIE Inc.

USA . 16 parts In-Stock

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AZTECH Wire

Italy . 79 parts In-Stock

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$14.230

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Component Stockers USA

USA . 479 parts In-Stock

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$99.990

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Kulean Microsystems

USA . 8,029 parts In-Stock

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Problanco Electronics

Mexico . 6,913 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,784 parts In-Stock

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SupplyDigital Components

Austria . 4,204 parts In-Stock

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TANS Electronics

Latvia . 3,763 parts In-Stock

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Corphita

USA . 1,805 parts In-Stock

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UHIMA Technologies

Türkiye . 787 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 106 parts In-Stock

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Overview

Unleash the power of seamless data transmission with the MC74HC574ANG by Onsemi. As a leader in the industry, Onsemi delivers top-quality bus drivers & transceivers that guarantee reliability and efficiency. Perfect for a wide range of applications, this product offers customers unparalleled value and benefits. Experience high performance, low power consumption, and exceptional functionality with the MC74HC574ANG. Trust Onsemi to provide innovative solutions that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various environments.

No. of Bits: 8

Having 8 bits allows for more data to be processed and transmitted efficiently.

Propagation Delay (tpd): 240 ns

The low propagation delay ensures fast communication and response times.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes the product suitable for use in harsh conditions.

Output Characteristics: 3-STATE

The 3-STATE output allows for greater flexibility in controlling the output signal.

Technical Specifications

Bus Driver & Transceivers MC74HC574ANG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

Length:

26.415 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

6 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

240 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Trade Compliance

MC74HC574ANG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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