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MC74HC574AF

Onsemi

MC74HC574AF by Onsemi

MC74HC574AF by Onsemi is an 8-bit bus driver with 3-STATE output. It operates at a supply voltage of 2-6V, with a propagation delay of 240ns. Ideal for applications requiring positive edge triggering and operating temperatures b/w -55 to 125 °C.

Median Price

$0.211

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 160 parts In-Stock

1+ parts

-

100+ parts

$0.211

1k+ parts

$0.175

10k+ parts

$0.156

160

-

$0.211

$0.175

$0.156

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,372 parts In-Stock

1+ parts

$0.164

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1,372

$0.164

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Vyrian

USA . 4,275 parts In-Stock

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4,275

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Distributors (Availability)

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Ampacity Inc.

Singapore . 160 parts In-Stock

1+ parts

$0.147

100+ parts

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160

$0.147

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Corphita

USA . 145 parts In-Stock

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$0.156

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145

$0.156

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Corohmni

South Africa . 477 parts In-Stock

1+ parts

$0.173

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477

$0.173

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AZTECH Wire

Italy . 986 parts In-Stock

1+ parts

$20.760

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986

$20.760

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Problanco Electronics

Mexico . 6,216 parts In-Stock

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Kulean Microsystems

USA . 5,518 parts In-Stock

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5,518

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TANS Electronics

Latvia . 3,275 parts In-Stock

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3,275

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SupplyDigital Components

Austria . 1,738 parts In-Stock

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1,738

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UHIMA Technologies

Türkiye . 920 parts In-Stock

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920

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Microchip USA

USA . 333 parts In-Stock

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333

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Overview

Enhance your electronic design projects with the MC74HC574AF by Onsemi, a top-tier manufacturer known for delivering high-quality bus drivers & transceivers. This versatile component offers customers unmatched reliability and efficiency in managing data transmission. With its 3-state output characteristics, true output polarity, positive edge trigger type, and maximum frequency of 20MHz, this product ensures seamless operation in various applications. Elevate your systems with the innovative technology and precision engineering of the MC74HC574AF, providing you with the competitive edge you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components of the bus driver & transceiver, ensuring a long lifespan.

Nominal Supply Voltage / Vsup (V): 3

Operating at a lower voltage helps in reducing power consumption and heat generation, making it energy-efficient.

Propagation Delay (tpd): 240 ns

Low propagation delay ensures quick signal transmission, enhancing the overall performance of the product.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, increasing its reliability.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this bus driver & transceiver efficient and reliable.

Technical Specifications

Bus Driver & Transceivers MC74HC574AF attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.575 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

6 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

240 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

5.275 mm

Trade Compliance

MC74HC574AF Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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