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MC74HC377ADTG

Onsemi

MC74HC377ADTG by Onsemi

MC74HC377ADTG by Onsemi is an 8-bit latch with a supply voltage of 5V, operating b/w -55 to 125 °C. It features positive edge triggering, CMOS technology, and a max I (ol) of 4A. Ideal for military-grade applications requiring compact design and high reliability.

Median Price

$0.324

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 900 parts In-Stock

1+ parts

-

100+ parts

$0.324

1k+ parts

$0.269

10k+ parts

$0.239

900

-

$0.324

$0.269

$0.239

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,479 parts In-Stock

1+ parts

$0.252

100+ parts

-

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-

10k+ parts

-

1,479

$0.252

-

-

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Vyrian

USA . 2,939 parts In-Stock

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2,939

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Distributors (Availability)

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Corphita

USA . 1,182 parts In-Stock

1+ parts

$0.238

100+ parts

-

1k+ parts

-

10k+ parts

-

1,182

$0.238

-

-

-

Corohmni

South Africa . 413 parts In-Stock

1+ parts

$0.265

100+ parts

-

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413

$0.265

-

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AZTECH Wire

Italy . 999 parts In-Stock

1+ parts

$8.970

100+ parts

-

1k+ parts

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999

$8.970

-

-

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Problanco Electronics

Mexico . 7,555 parts In-Stock

1+ parts

-

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7,555

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TANS Electronics

Latvia . 6,367 parts In-Stock

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6,367

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SupplyDigital Components

Austria . 6,096 parts In-Stock

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6,096

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Kulean Microsystems

USA . 5,904 parts In-Stock

1+ parts

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5,904

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UHIMA Technologies

Türkiye . 225 parts In-Stock

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225

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Microchip USA

USA . 223 parts In-Stock

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223

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Overview

Discover the MC74HC377ADTG by Onsemi, a top-of-the-line latch & flip-flop that delivers unparalleled quality and reliability. Onsemi's reputation for excellence shines through in this product, offering customers a versatile solution for various applications. With its innovative design and advanced technology, this product ensures seamless performance and efficiency. Experience the value and benefits of the MC74HC377ADTG, providing customers with a competitive edge in their projects. Elevate your applications with this exceptional product from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the latch durable and resistant to shocks and impacts.

Surface Mount: YES

Being surface mountable allows for easier and more efficient installation on PCBs, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this latch compatible with a wide range of electronic devices and systems.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this latch can withstand harsh environmental conditions and prolonged use without overheating.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this latch an energy-efficient and reliable choice.

Technical Specifications

Latches & Flip-Flops MC74HC377ADTG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

RAIL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Trade Compliance

MC74HC377ADTG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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