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MC74HC374ANG

Onsemi

MC74HC374ANG by Onsemi

MC74HC374ANG by Onsemi is an 8-bit bus driver with 3-STATE output. It operates at a supply voltage of 2-6V, has a propagation delay of 190ns, and supports a max frequency of 20MHz. Ideal for applications requiring high-speed data transfer in military-grade environments.

Median Price

$0.619

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 12,058 parts In-Stock

1+ parts

-

100+ parts

$0.608

1k+ parts

$0.504

10k+ parts

$0.450

12,058

-

$0.608

$0.504

$0.450

Verical

USA . 4,985 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.630

10k+ parts

$0.562

4,985

-

-

$0.630

$0.562

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 228 parts In-Stock

1+ parts

$0.473

100+ parts

-

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228

$0.473

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Vyrian

USA . 7,507 parts In-Stock

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7,507

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J2 Sourcing AB

Sweden . 55 parts In-Stock

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55

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Distributors (Availability)

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Corphita

USA . 2,231 parts In-Stock

1+ parts

$0.448

100+ parts

-

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-

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2,231

$0.448

-

-

-

Corohmni

South Africa . 292 parts In-Stock

1+ parts

$0.476

100+ parts

-

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-

292

$0.476

-

-

-

Component Stockers USA

USA . 14,915 parts In-Stock

1+ parts

$0.510

100+ parts

$0.480

1k+ parts

$0.430

10k+ parts

$0.430

14,915

$0.510

$0.480

$0.430

$0.430

AZTECH Wire

Italy . 280 parts In-Stock

1+ parts

$12.310

100+ parts

-

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280

$12.310

-

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Continental Prestige Electronics

USA . 12,158 parts In-Stock

1+ parts

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100+ parts

$0.423

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12,158

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$0.423

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Kulean Microsystems

USA . 5,569 parts In-Stock

1+ parts

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5,569

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SupplyDigital Components

Austria . 3,168 parts In-Stock

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Problanco Electronics

Mexico . 907 parts In-Stock

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907

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UHIMA Technologies

Türkiye . 502 parts In-Stock

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502

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Microchip USA

USA . 433 parts In-Stock

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433

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TANS Electronics

Latvia . 346 parts In-Stock

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346

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Overview

Unleash the power of innovation with the MC74HC374ANG by Onsemi, a top-of-the-line Bus Driver & Transceivers component designed to elevate your electronic projects to new heights. With a focus on precision and reliability, Onsemi ensures that each product meets the highest standards of quality. This versatile device is perfect for a wide range of applications, offering customers unparalleled value and performance. Say goodbye to limitations and hello to endless possibilities with the MC74HC374ANG from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to impact, making the product suitable for rough handling.

No. of Bits: 8

8 bits provide a wide range of data transmission capabilities, allowing for complex communication protocols to be implemented.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V, the product offers energy efficiency and compatibility with a range of power sources.

Propagation Delay (tpd): 190 ns

The low propagation delay of 190 ns ensures fast and efficient data transmission, making the product suitable for real-time applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, the product can withstand high temperature environments, ensuring reliability in various conditions.

Output Characteristics: 3-STATE

The 3-state output allows the bus driver/transceiver to control the output signal with three states (High, Low, and High Impedance), providing flexibility in data transmission.

Terminal Finish: Tin (Sn)

The tin terminal finish provides excellent solderability and corrosion resistance, ensuring a reliable electrical connection.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product suitable for battery-operated devices and in noisy environments.

Technical Specifications

Bus Driver & Transceivers MC74HC374ANG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

Length:

26.415 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

6 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

190 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Trade Compliance

MC74HC374ANG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-633-2073, 5962016332073

NIIN

016332073

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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