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MC74HC373AFELG

Onsemi

MC74HC373AFELG by Onsemi

MC74HC373AFELG by Onsemi is an 8-bit bus driver with 38ns propagation delay, operating at 3V. It features a small outline package and true output polarity. Ideal for military-grade applications requiring fast signal transmission in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,844 parts In-Stock

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Digiode

USA . 1,294 parts In-Stock

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AZTECH Wire

Italy . 645 parts In-Stock

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$22.040

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Kulean Microsystems

USA . 7,844 parts In-Stock

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TANS Electronics

Latvia . 5,038 parts In-Stock

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Microchip USA

USA . 4,888 parts In-Stock

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Problanco Electronics

Mexico . 4,319 parts In-Stock

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Corphita

USA . 1,780 parts In-Stock

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Kepictronics

USA . 1,459 parts In-Stock

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UHIMA Technologies

Türkiye . 631 parts In-Stock

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SupplyDigital Components

Austria . 408 parts In-Stock

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Corohmni

South Africa . 176 parts In-Stock

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Overview

Unleash the power of seamless data transmission with the MC74HC373AFELG by Onsemi. Crafted with precision and quality in mind, this bus driver & transceiver offers unparalleled performance and reliability for your electronic projects. With a small outline package design and 3-STATE output characteristics, this product is ideal for industrial applications where speed and efficiency are crucial. Trust Onsemi's expertise in semiconductor technology to enhance your systems with this top-of-the-line component, delivering value and benefits that will elevate your projects to new heights. Upgrade your devices today with the MC74HC373AFELG and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body makes the product lightweight and durable, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 38 ns

The low propagation delay at nominal supply allows for fast signal transmission, making this product suitable for high-speed data communication.

Surface Mount: YES

The surface mount feature makes installation and assembly of the product easier and more efficient, saving time and effort during the manufacturing process.

Package Shape: RECTANGULAR

The rectangular package shape is space-efficient and allows for easy integration into various electronic systems or circuit boards.

Nominal Supply Voltage / Vsup (V): 3

The 3V nominal supply voltage is within a common range for many electronic devices, making this product compatible with a wide range of applications.

Load Capacitance (CL): 50 pF

The 50 pF load capacitance ensures stable and efficient performance, especially in high-frequency applications where capacitance can affect signal transmission.

Power Supplies (V): 2/6

The product supports power supplies ranging from 2V to 6V, providing flexibility for different power requirements in various electronic systems.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow for tri-state logic operation, enabling the device to effectively control bus access and reduce bus contention.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, making it ideal for battery-operated devices or applications where noise can be a concern.

Technical Specifications

Bus Driver & Transceivers MC74HC373AFELG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.575 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

38 ns

Propagation Delay (tpd):

210 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

5.275 mm

Trade Compliance

MC74HC373AFELG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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