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MC74HC273AFEL

Onsemi

MC74HC273AFEL by Onsemi

MC74HC273AFEL by Onsemi is an 8-bit latch with Vsup of 3V, tpd of 220ns, and fmax of 24MHz. Ideal for military-grade applications due to its MIL-graded temperature range and small outline package style. Suitable for surface mount designs requiring fast data processing at a max frequency of 20MHz.

Median Price

$0.404

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,000 parts In-Stock

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-

100+ parts

$0.396

1k+ parts

$0.329

10k+ parts

$0.293

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$0.396

$0.329

$0.293

Verical

USA . 4,000 parts In-Stock

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$0.411

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$0.367

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$0.411

$0.367

Distributors (In-Stock)

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Digiode

USA . 1,742 parts In-Stock

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$0.309

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$0.309

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Mentor Electronics Marketing, LLC

USA . 5,649 parts In-Stock

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Vyrian

USA . 5,296 parts In-Stock

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Lantek

USA . 1,961 parts In-Stock

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Extreme Components

USA . 737 parts In-Stock

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Connector Distribution Corp

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Right Parts Inc.

USA . 121 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 3,545 parts In-Stock

1+ parts

$0.264

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$0.264

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Corphita

USA . 598 parts In-Stock

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$0.292

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Corohmni

South Africa . 388 parts In-Stock

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$0.310

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Component Stockers USA

USA . 5,661 parts In-Stock

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$0.330

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$0.310

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$0.280

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AZTECH Wire

Italy . 270 parts In-Stock

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$8.070

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Kulean Microsystems

USA . 8,011 parts In-Stock

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TANS Electronics

Latvia . 7,301 parts In-Stock

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SupplyDigital Components

Austria . 5,810 parts In-Stock

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Continental Prestige Electronics

USA . 4,000 parts In-Stock

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$0.276

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RC Electronics

USA . 4,000 parts In-Stock

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Assy Fe

Spain . 2,305 parts In-Stock

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Kepictronics

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GreenTree Electronics

Israel . 1,961 parts In-Stock

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Problanco Electronics

Mexico . 1,565 parts In-Stock

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UHIMA Technologies

Türkiye . 495 parts In-Stock

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Microchip USA

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Overview

Unlock unparalleled performance and reliability with the MC74HC273AFEL latch & flip-flop by Onsemi. Crafted with precision and expertise, this product boasts a range of applications in various industries. From industrial automation to consumer electronics, this versatile component offers high-quality output and seamless operation. Elevate your projects with the value and benefits that only Onsemi can provide, ensuring efficiency and innovation every step of the way. Choose Onsemi for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection, making this latch/flip-flop resistant to impact and environmental factors.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving space and simplifying assembly.

No. of Bits: 8

8 bits allow for handling of larger and more complex data sets, making this latch/flip-flop suitable for a wide range of applications.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V makes this latch/flip-flop energy efficient and suitable for low power applications.

Propagation Delay (tpd): 220 ns

Low propagation delay ensures quick response and efficient operation, making this latch/flip-flop ideal for high-speed applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this latch/flip-flop can withstand harsh environmental conditions and maintain reliability under extreme heat.

Trigger Type: POSITIVE EDGE

Positive edge triggering allows for precise control and synchronization of data, making this latch/flip-flop suitable for applications requiring accurate timing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this latch/flip-flop energy efficient and reliable in noisy environments.

Technical Specifications

Latches & Flip-Flops MC74HC273AFEL attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.575 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

220 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

5.275 mm

Minimum fmax:

24 MHz

Trade Compliance

MC74HC273AFEL Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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