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MC74HC112ADG

Onsemi

MC74HC112ADG by Onsemi

MC74HC112ADG by Onsemi is a 16-terminal latches & flip-flops IC with 2 functions, operating at -55 to 125 °C. It has a propagation delay of 250 ns, max frequency of 20 MHz, and operates on a supply voltage range of 2-6 V. Ideal for military-grade applications requiring positive edge triggering in compact designs.

Median Price

$0.368

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 50 parts In-Stock

1+ parts

$0.480

100+ parts

$0.277

1k+ parts

-

10k+ parts

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50

$0.480

$0.277

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Flip Electronics (Authorized)

USA . 4,416 parts In-Stock

1+ parts

-

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4,416

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Rochester

USA . 28 parts In-Stock

1+ parts

-

100+ parts

$0.256

1k+ parts

$0.213

10k+ parts

$0.190

28

-

$0.256

$0.213

$0.190

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 99 parts In-Stock

1+ parts

$0.200

100+ parts

-

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-

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99

$0.200

-

-

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Ozdisan Elektronik

Türkiye . 2 parts In-Stock

1+ parts

$0.941

100+ parts

-

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2

$0.941

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Vyrian

USA . 7,216 parts In-Stock

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7,216

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Flip Electronics

USA . 4,416 parts In-Stock

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4,416

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 656 parts In-Stock

1+ parts

$0.189

100+ parts

-

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656

$0.189

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-

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Corohmni

South Africa . 76 parts In-Stock

1+ parts

$0.210

100+ parts

-

1k+ parts

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10k+ parts

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76

$0.210

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Component Stockers USA

USA . 875 parts In-Stock

1+ parts

$0.220

100+ parts

$0.370

1k+ parts

$0.220

10k+ parts

-

875

$0.220

$0.370

$0.220

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Kulean Microsystems

USA . 5,413 parts In-Stock

1+ parts

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5,413

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Problanco Electronics

Mexico . 5,252 parts In-Stock

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5,252

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Kepictronics

USA . 5,232 parts In-Stock

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5,232

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Perfect Parts

USA . 4,612 parts In-Stock

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4,612

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TANS Electronics

Latvia . 2,398 parts In-Stock

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2,398

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SupplyDigital Components

Austria . 1,799 parts In-Stock

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1,799

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UHIMA Technologies

Türkiye . 228 parts In-Stock

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228

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Overview

Upgrade your electronic designs with the MC74HC112ADG by Onsemi, a top-quality latches & flip-flops component that offers unparalleled performance and reliability. With a MILITARY-grade temperature grade, this product is perfect for demanding applications where precision is key. Its small outline package style and dual terminal position make it easy to integrate into any project. Experience fast propagation delay, high output frequency, and versatile trigger options with this innovative technology. Trust Onsemi's reputation for excellence in semiconductor manufacturing and unlock the full potential of your creations with the MC74HC112ADG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring longevity and reliability of the product.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and effort during the manufacturing process.

No. of Functions: 2

Offering dual functionality in a single component, allowing for more versatile and complex circuit designs.

Trigger Type: POSITIVE EDGE

Provides precise control over the switching mechanism, ensuring accurate and reliable operation.

Propagation Delay (tpd): 250 ns

Offers fast response times, crucial for time-sensitive applications where quick signal transitions are required.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for use in harsh or industrial environments.

Technology: CMOS

Utilizes low power consumption and allows for compatibility with a wide range of voltage levels, making it energy-efficient and versatile.

Technical Specifications

Latches & Flip-Flops MC74HC112ADG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

250 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

35 MHz

Trade Compliance

MC74HC112ADG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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