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MC74ACT652NG

Onsemi

MC74ACT652NG by Onsemi

MC74ACT652NG by Onsemi is an 8-bit bus driver with 16.5ns propagation delay at 5V, ideal for industrial applications. It features a 24A max I (ol), operates b/w -40 to 85 °C, and has a package style of IN-LINE.

Median Price

$1.649

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 15,680 parts In-Stock

1+ parts

-

100+ parts

$1.560

1k+ parts

$1.390

10k+ parts

$1.310

15,680

-

$1.560

$1.390

$1.310

Verical

USA . 9,630 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.738

10k+ parts

$1.637

9,630

-

-

$1.738

$1.637

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,206 parts In-Stock

1+ parts

$1.644

100+ parts

-

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2,206

$1.644

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-

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DigiKey Marketplace

USA . 15,680 parts In-Stock

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-

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15,680

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-

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Vyrian

USA . 3,710 parts In-Stock

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3,710

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 129 parts In-Stock

1+ parts

$1.557

100+ parts

-

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-

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129

$1.557

-

-

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Corohmni

South Africa . 340 parts In-Stock

1+ parts

$1.730

100+ parts

-

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340

$1.730

-

-

-

AZTECH Wire

Italy . 273 parts In-Stock

1+ parts

$20.900

100+ parts

-

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273

$20.900

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QUARKTWIN TECHNOLOGY LTD

USA . 15,964 parts In-Stock

1+ parts

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15,964

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Continental Prestige Electronics

USA . 15,680 parts In-Stock

1+ parts

-

100+ parts

$1.500

1k+ parts

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15,680

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$1.500

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SupplyDigital Components

Austria . 7,552 parts In-Stock

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7,552

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Kulean Microsystems

USA . 4,320 parts In-Stock

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4,320

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UHIMA Technologies

Türkiye . 682 parts In-Stock

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682

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Microchip USA

USA . 415 parts In-Stock

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415

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Problanco Electronics

Mexico . 257 parts In-Stock

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257

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TANS Electronics

Latvia . 215 parts In-Stock

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215

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Overview

Discover the power of seamless data transmission with the MC74ACT652NG from Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in their products. Ideal for bus driver & transceivers applications, this 8-bit device offers a fast propagation delay of 16.5 ns, making it perfect for high-speed data transfer. With a wide operating temperature range and dual terminal position, this product provides unmatched value and performance to customers. Upgrade your system today with the MC74ACT652NG and experience superior connectivity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability for long-lasting use.

Propagation Delay At Nominal Supply: 16.5 ns

Low propagation delay ensures fast and efficient data transmission.

No. of Bits: 8

8 bits provide sufficient data capacity for communication between devices.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage for compatibility with most systems.

Maximum I (ol): 24 Amp

High output current capability allows for driving various loads.

Minimum Operating Temperature: -40 °C

Wide operating temperature range makes it suitable for different environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Technical Specifications

Bus Driver & Transceivers MC74ACT652NG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Additional Features:

SELECT INPUT FOR MULTIPLEXED TRANSMISSION OF REGISTERED/REAL TIME DATA

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ACT

JESD-30 Code:

R-PDIP-T24

JESD-609 Code:

e3

Length:

31.69 mm

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

16.5 ns

Propagation Delay (tpd):

16.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Trade Compliance

MC74ACT652NG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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