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MC74ACT374NG

Onsemi

MC74ACT374NG by Onsemi

MC74ACT374NG by Onsemi is an 8-bit bus driver with a supply voltage of 5V and 3-STATE output. It has a propagation delay of 11.5ns, operating temperature range from -40 to 85 °C, and supports a max frequency of 90MHz. Ideal for industrial applications requiring high-speed data transfer in a compact IN-LINE package.

Median Price

$0.700

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 762 parts In-Stock

1+ parts

-

100+ parts

$0.687

1k+ parts

$0.570

10k+ parts

$0.508

762

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$0.687

$0.570

$0.508

Verical

USA . 762 parts In-Stock

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-

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$0.713

10k+ parts

$0.635

762

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$0.713

$0.635

Distributors (In-Stock)

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Digiode

USA . 2,365 parts In-Stock

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$0.535

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$0.535

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Vyrian

USA . 5,977 parts In-Stock

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J2 Sourcing AB

Sweden . 1,327 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 630 parts In-Stock

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630

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Distributors (Availability)

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Ampacity Inc.

Singapore . 886 parts In-Stock

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$0.457

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886

$0.457

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Corphita

USA . 982 parts In-Stock

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$0.507

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982

$0.507

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Corohmni

South Africa . 312 parts In-Stock

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$0.538

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312

$0.538

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AZTECH Wire

Italy . 733 parts In-Stock

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$14.750

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$14.750

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QUARKTWIN TECHNOLOGY LTD

USA . 27,162 parts In-Stock

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Kulean Microsystems

USA . 8,239 parts In-Stock

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TANS Electronics

Latvia . 7,544 parts In-Stock

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Problanco Electronics

Mexico . 1,909 parts In-Stock

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Continental Prestige Electronics

USA . 1,234 parts In-Stock

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$0.478

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SupplyDigital Components

Austria . 738 parts In-Stock

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Authorized Procurement Solutions

USA . 630 parts In-Stock

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GreenTree Electronics

Israel . 630 parts In-Stock

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UHIMA Technologies

Türkiye . 321 parts In-Stock

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Perfect Parts

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Microchip USA

USA . 116 parts In-Stock

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Overview

Enhance your electronic designs with the MC74ACT374NG by Onsemi, a top-of-the-line bus driver and transceiver that guarantees reliable performance and quality. Crafted by the reputable manufacturer Onsemi, this product is designed to meet the highest industry standards. With its 3-state output characteristics and true output polarity, this component ensures seamless integration into your projects. Whether you're working on industrial automation or communication systems, the MC74ACT374NG offers unparalleled value with its fast propagation delay of 11.5 ns and maximum frequency of 90 MHz. Upgrade your circuits today with this cutting-edge solution from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the product durable and lightweight, ensuring it can withstand the rigors of daily use in a bus driver application.

No. of Bits: 8

Having 8 bits allows for a wide range of data transmission and processing capabilities, making this product suitable for handling various communication protocols in a bus driver system.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V ensures compatibility with standard power sources, making it easy to integrate this transceiver into existing bus systems.

Maximum I (ol): 24 Amp

The high maximum output current capability of 24 Amps allows the transceiver to drive heavy loads in the bus system without overheating or malfunctioning.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this transceiver can function reliably in extreme cold weather conditions often encountered in bus applications.

Maximum Frequency At Nominal Supply: 90000000 Hz

The high maximum frequency capability of 90 MHz enables fast and efficient data transmission within the bus system, reducing latency and improving overall performance.

Technical Specifications

Bus Driver & Transceivers MC74ACT374NG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

ACT

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

Length:

26.415 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

90000000 Hz

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

11.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Trade Compliance

MC74ACT374NG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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