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MC74AC541MELG

Onsemi

MC74AC541MELG by Onsemi

MC74AC541MELG by Onsemi is an 8-bit bus driver with 9ns propagation delay at 5V. It features 3-STATE output, operates b/w -40 to 85 °C, and supports supply voltages of 3.3/5V. Ideal for industrial applications requiring fast signal transmission in a compact small outline package.

Median Price

$0.512

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

$0.502

1k+ parts

$0.417

10k+ parts

$0.371

10,000

-

$0.502

$0.417

$0.371

Verical

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.521

10k+ parts

$0.464

10,000

-

-

$0.521

$0.464

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,337 parts In-Stock

1+ parts

$0.391

100+ parts

-

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2,337

$0.391

-

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-

Vyrian

USA . 3,189 parts In-Stock

1+ parts

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3,189

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,812 parts In-Stock

1+ parts

$0.371

100+ parts

-

1k+ parts

-

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1,812

$0.371

-

-

-

Corohmni

South Africa . 87 parts In-Stock

1+ parts

$0.412

100+ parts

-

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10k+ parts

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87

$0.412

-

-

-

AZTECH Wire

Italy . 508 parts In-Stock

1+ parts

$11.830

100+ parts

-

1k+ parts

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508

$11.830

-

-

-

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$12.212

100+ parts

$11.113

1k+ parts

$10.014

10k+ parts

-

500

$12.212

$11.113

$10.014

-

Continental Prestige Electronics

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.357

10k+ parts

-

10,000

-

-

$0.357

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SupplyDigital Components

Austria . 6,480 parts In-Stock

1+ parts

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100+ parts

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6,480

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Kulean Microsystems

USA . 3,895 parts In-Stock

1+ parts

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3,895

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TANS Electronics

Latvia . 1,149 parts In-Stock

1+ parts

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1,149

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Problanco Electronics

Mexico . 803 parts In-Stock

1+ parts

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803

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UHIMA Technologies

Türkiye . 677 parts In-Stock

1+ parts

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677

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Microchip USA

USA . 390 parts In-Stock

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390

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Overview

Enhance the performance of your electronic applications with the MC74AC541MELG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality bus drivers & transceivers like no other. This product offers seamless integration, fast propagation delay, and 3-state output characteristics, making it ideal for a wide range of applications. Experience reliable functionality, efficient power supplies, and versatile terminal options with the MC74AC541MELG. Elevate your projects with Onsemi's cutting-edge technology and trust in the superior quality that this product provides.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Propagation Delay At Nominal Supply: 9 ns

Low propagation delay ensures fast response and efficient communication.

Surface Mount: YES

Allows for easy integration onto PCBs for space-saving and streamlined design.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage requirement for compatibility with various systems.

Output Characteristics: 3-STATE

Enables tristate output, providing flexibility in controlling bus lines.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity.

Technical Specifications

Bus Driver & Transceivers MC74AC541MELG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

AC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.575 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC74AC541MELG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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