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MC44603DW

Onsemi

MC44603DW by Onsemi

MC44603DW by Onsemi is a switching controller with max output current of 0.75A and max switching frequency of 250kHz. Ideal for applications requiring pulse width modulation control technique, such as power supplies and voltage regulators. Package style is small outline, making it suitable for compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,837 parts In-Stock

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1,837

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Vyrian

USA . 693 parts In-Stock

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693

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TANS Electronics

Latvia . 7,058 parts In-Stock

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7,058

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Problanco Electronics

Mexico . 3,320 parts In-Stock

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3,320

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SupplyDigital Components

Austria . 1,241 parts In-Stock

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Kulean Microsystems

USA . 1,157 parts In-Stock

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1,157

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UHIMA Technologies

Türkiye . 726 parts In-Stock

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726

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Corphita

USA . 411 parts In-Stock

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Kepictronics

USA . 240 parts In-Stock

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Corohmni

South Africa . 68 parts In-Stock

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Overview

Boost your power management capabilities with the MC44603DW by Onsemi! As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and reliability. This switching regulator & controller is perfect for a wide range of applications, offering unparalleled performance and efficiency. With its current-mode control mode and pulse width modulation technique, this product ensures optimal power delivery with minimal energy loss. Say goodbye to power supply issues and hello to seamless operations with the MC44603DW!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the product lightweight and durable, making it suitable for applications requiring portability and reliability.

Surface Mount: YES

Being surface mountable, this product can be easily integrated onto circuit boards, simplifying the assembly process and saving space in compact designs.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient placement on a circuit board, optimizing space utilization and facilitating a neat and organized layout.

No. of Terminals: 16

With 16 terminals, this product offers a sufficient number of connection points for various input and output requirements, enhancing flexibility in circuit configuration.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes the footprint of the product, making it ideal for space-constrained applications where compactness is essential.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in demanding environments, making this product suitable for industrial and automotive applications.

Control Mode: CURRENT-MODE

The current-mode control technique offers improved transient response and better noise immunity, enhancing the stability and efficiency of the switching regulator.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature allows for operation in cold conditions, making this product versatile and suitable for use in a wide range of temperature environments.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and reliable electrical connections, ensuring robust performance and ease of installation in various applications.

Terminal Position: DUAL

Having dual terminal positions allows for flexible mounting options and facilitates efficient routing of connections, contributing to ease of installation and maintenance.

Maximum Seated Height: 2.65 mm

The low maximum seated height enables low-profile designs and helps reduce the overall size of the product, making it suitable for slim and compact electronic devices.

Width (mm): 7.5 mm

With a width of 7.5mm, this product offers a compact form factor, making it ideal for applications where space constraints are a concern.

Other IC type: SWITCHING CONTROLLER

The use of a switching controller IC enhances the efficiency and performance of the regulator, allowing for precise voltage regulation and improved power conversion capabilities.

Nominal Input Voltage: 12 V

The nominal input voltage of 12V makes this product compatible with a wide range of power sources, offering versatility and compatibility with standard voltage levels.

Peak Reflow Temperature °C: 235

With a high peak reflow temperature of 235 °C, this product can withstand the reflow soldering process during assembly, ensuring reliable and robust solder joints.

Length: 10.3 mm

The length of 10.3mm contributes to the compact size of the product, making it ideal for applications where space-saving and efficient layout are essential.

Maximum Switching Frequency: 250 kHz

The high maximum switching frequency of 250 kHz allows for fast and efficient power conversion, enabling high-performance operation and reducing electromagnetic interference.

Maximum Output Current: 0.75 A

With a maximum output current of 0.75A, this product can deliver sufficient power to drive various loads, making it suitable for a wide range of applications.

Technology: BIPOLAR

The use of bipolar technology ensures high efficiency and low noise operation, enhancing the performance and reliability of the switching regulator in various operating conditions.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and allows for secure and reliable connections, ensuring stable operation and ease of assembly.

Control Technique: PULSE WIDTH MODULATION

The pulse width modulation control technique provides precise regulation of output voltage, improving efficiency and response time, and minimizing ripple and noise in the output.

Switcher Config: SINGLE

The single switcher configuration simplifies the design and operation of the regulator, offering a cost-effective and efficient solution for power management applications.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27mm provides adequate spacing for easy soldering and installation, ensuring secure connections and reliable performance in the circuit.

Minimum Input Voltage: 10 V

With a minimum input voltage of 10V, this product can operate efficiently even with lower input power sources, offering flexibility and compatibility with a wide range of voltage levels.

Maximum Input Voltage: 15 V

The maximum input voltage of 15V provides protection against overvoltage conditions, ensuring safe operation and reliable performance in various power supply applications.

Technical Specifications

Switching Regulators & Controllers MC44603DW attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Additional Features:

ALSO CONFIGURABLE IN CURRENT MODE

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

15 V

Minimum Input Voltage:

10 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Maximum Output Current:

.75 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

250 kHz

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

7.5 mm

Trade Compliance

MC44603DW Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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