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MC44603AP

Onsemi

MC44603AP by Onsemi

MC44603AP by Onsemi is a switching controller with voltage-mode control technique. It operates b/w -25 to 85 °C and has a max output current of 0.75 A. With a package style of IN-LINE, it is ideal for applications requiring pulse width modulation in the range of 10-18.5 V input voltage.

Median Price

$3.960

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 492 parts In-Stock

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$3.960

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$2.590

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Digiode

USA . 1,891 parts In-Stock

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$3.762

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Vyrian

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Flip Electronics

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Q Components

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Electronic Expediters

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ACDS - Activité Composants Distribution Service

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LittleDiode

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Fibra_Brandt Electronic GMBH

Germany . 14 parts In-Stock

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Donberg Electronics Ltd

Ireland . 1 parts In-Stock

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Corphita

USA . 374 parts In-Stock

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$3.564

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Corohmni

South Africa . 239 parts In-Stock

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Kepictronics

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A-Z Elektronik GmbH

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Perfect Parts

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TANS Electronics

Latvia . 2,082 parts In-Stock

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SupplyDigital Components

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UHIMA Technologies

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Authorized Procurement Solutions

USA . 492 parts In-Stock

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GreenTree Electronics

Israel . 492 parts In-Stock

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Microchip USA

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Problanco Electronics

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Kulean Microsystems

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Overview

Enhance your electronic designs with the MC44603AP from Onsemi, a reputable manufacturer known for its high-quality products. This switching regulator and controller offers reliable performance and precise voltage control, making it ideal for a wide range of applications. Whether you're designing power supplies or implementing voltage regulation in your circuit, this versatile IC delivers exceptional value and efficiency. Trust Onsemi to provide cutting-edge solutions that meet your design needs and exceed your expectations. Upgrade your projects with the MC44603AP and experience the benefits of superior quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the switching regulator.

Maximum Operating Temperature: 85 °C

Ensures stable performance even in high-temperature environments.

Nominal Input Voltage: 12 V

Suitable for various applications requiring a 12V input voltage.

Maximum Output Current: 0.75 A

Capable of delivering a decent amount of current for powering components or devices.

Control Technique: PULSE WIDTH MODULATION

Efficient control method for regulating the output voltage of the switching regulator.

Technical Specifications

Switching Regulators & Controllers MC44603AP attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Additional Features:

CAN ALSO OPERATE IN CURRENT MODE

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

18.5 V

Minimum Input Voltage:

10 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

Length:

19.175 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Maximum Output Current:

.75 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

NO

Switcher Config:

SINGLE

Maximum Switching Frequency:

250 kHz

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

MC44603AP Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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