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MC44603ADW

Onsemi

MC44603ADW by Onsemi

MC44603ADW by Onsemi is a voltage-mode switching controller with max output current of 0.75A and max switching frequency of 250kHz. Ideal for applications requiring small outline package style, such as power supplies in consumer electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 1,634 parts In-Stock

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Digiode

USA . 979 parts In-Stock

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ECAB

Sweden . 10 parts In-Stock

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SupplyDigital Components

Austria . 6,428 parts In-Stock

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Kulean Microsystems

USA . 4,030 parts In-Stock

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Problanco Electronics

Mexico . 2,172 parts In-Stock

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Corphita

USA . 1,659 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 457 parts In-Stock

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TANS Electronics

Latvia . 357 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 247 parts In-Stock

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Overview

Enhance your power management solutions with the MC44603ADW from Onsemi. As a leading manufacturer in switching regulators & controllers, Onsemi guarantees quality and reliability in every product. This versatile device offers a voltage-mode control mode, allowing for efficient power regulation. With a maximum output current of 0.75A and a wide input voltage range of 10V to 18.5V, this switching controller is perfect for a variety of applications. From consumer electronics to industrial equipment, the MC44603ADW provides value, performance, and peace of mind to customers looking for superior power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protects the internal components of the regulator, ensuring a longer lifespan.

Surface Mount: YES

Easy surface mounting allows for convenient installation on circuit boards, saving time and effort during production.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to integrate the regulator into various electronic devices and designs.

No. of Terminals: 16

Having 16 terminals provides flexibility in connecting the regulator to other components and peripherals in the circuit.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and enables compact device designs.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures stable performance even under demanding environmental conditions.

Control Mode: VOLTAGE-MODE

Voltage-mode control allows for precise regulation of output voltage, ensuring stable power delivery to the load.

Minimum Operating Temperature: -25 °C

Low minimum operating temperature enables reliable operation in colder environments without performance degradation.

Terminal Finish: TIN LEAD

Tin lead finish provides good solderability and ensures secure connections with other components.

Terminal Position: DUAL

Dual terminal position offers versatility in circuit board layout and component positioning.

Maximum Seated Height: 2.65 mm

Low seated height allows for thinner device profiles and compact design implementation.

Width (mm): 7.5 mm

Narrow width enables placement in tight spaces and contributes to overall space-saving in electronic assemblies.

Other IC type: SWITCHING CONTROLLER

Utilizing a switching controller IC enhances efficiency, reduces power losses, and enables precise control over the output voltage.

Nominal Input Voltage: 12 V

Suitable nominal input voltage of 12V makes this regulator compatible with a wide range of power sources and applications.

Maximum Switching Frequency: 250 kHz

High switching frequency allows for fast response times and efficient regulation of output voltage.

Maximum Output Current: 0.75 A

Capable of delivering up to 0.75A of output current, suitable for powering various electronic devices and components.

Technology: BIPOLAR

Bipolar technology offers stable and reliable performance in regulating the output voltage, ensuring consistent power delivery.

Terminal Form: GULL WING

Gull wing terminal form enhances solder joint strength and mechanical stability, improving the overall reliability of the regulator.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation control technique allows for efficient power conversion and precise output voltage regulation.

Switcher Config: SINGLE

Single switcher configuration simplifies the design and operation of the regulator, making it more user-friendly and efficient.

Terminal Pitch: 1.27 mm

Standard terminal pitch of 1.27mm facilitates easy integration into existing circuit board layouts and designs.

Minimum Input Voltage: 10 V

Low minimum input voltage requirement of 10V provides flexibility in power source selection and compatibility with different applications.

Maximum Input Voltage: 18.5 V

High maximum input voltage rating of 18.5V allows for versatile use with various power sources while ensuring safe operation.

Technical Specifications

Switching Regulators & Controllers MC44603ADW attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Additional Features:

ALSO CONFIGURABLE IN CURRENT MODE

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

18.5 V

Minimum Input Voltage:

10 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Maximum Output Current:

.75 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

250 kHz

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

7.5 mm

Trade Compliance

MC44603ADW Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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