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MC33161DMR2

Onsemi

MC33161DMR2 by Onsemi

MC33161DMR2 by Onsemi is a power management IC with a supply voltage range of 2V to 40V. It has a small outline, thin profile package style and operates in industrial temperature range (-40°C to 105°C). This IC is suitable for power supply support circuits with its dual terminal position and bipolar technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 14,900 parts In-Stock

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14,900

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Vyrian

USA . 7,227 parts In-Stock

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7,227

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R&J Components

USA . 1,565 parts In-Stock

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1,565

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Digiode

USA . 464 parts In-Stock

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464

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,415 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

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1,415

$0.500

$0.488

$0.485

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Ampacity Inc.

Singapore . 433 parts In-Stock

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$0.500

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433

$0.500

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AZTECH Wire

Italy . 624 parts In-Stock

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$7.667

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624

$7.667

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Aztec Data Supply Inc.

USA . 4,225 parts In-Stock

1+ parts

$22.366

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4,225

$22.366

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SupplyDigital Components

Austria . 7,392 parts In-Stock

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7,392

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Problanco Electronics

Mexico . 6,779 parts In-Stock

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6,779

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Kulean Microsystems

USA . 3,291 parts In-Stock

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3,291

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Continental Prestige Electronics

USA . 2,600 parts In-Stock

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2,600

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Argo Parts USA

USA . 2,491 parts In-Stock

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2,491

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TANS Electronics

Latvia . 2,066 parts In-Stock

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2,066

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Corphita

USA . 1,892 parts In-Stock

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1,892

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UHIMA Technologies

Türkiye . 700 parts In-Stock

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700

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Microchip USA

USA . 413 parts In-Stock

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413

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Corohmni

South Africa . 71 parts In-Stock

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71

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Bastille Electronics

Australia . 50 parts In-Stock

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50

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Overview

Discover the power of the MC33161DMR2 by Onsemi, a high-quality Power Management IC that offers unmatched performance and reliability. With its advanced design and innovative features, this product is perfect for a wide range of applications in various industries. Manufactured by Onsemi, a trusted leader in the industry, you can be assured of the highest standards of quality and durability. The MC33161DMR2 delivers exceptional value and benefits to customers, providing efficient power supply support and superior functionality. Don't settle for anything less than the best – choose the MC33161DMR2 and experience the advantages it brings to your projects.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material enhances the durability and reliability of the power management IC, making it suitable for various applications.

Surface Mount

YES - The surface mount feature allows for easy installation and space-saving on circuit boards, optimizing the overall design.

No. of Functions

1 - With a single function, this power management IC simplifies the circuit design and reduces complexity, improving overall efficiency.

Package Shape

SQUARE - The square package shape offers better compatibility and increased stability when mounting the IC, ensuring a secure connection.

Nominal Supply Voltage (Vsup)

5 V - The nominal supply voltage of 5V allows for compatibility with a wide range of electronic devices and power sources.

No. of Terminals

8 - The availability of 8 terminals allows for versatile connectivity options, enabling smooth integration within electronic systems.

Package Style (Meter)

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - This package style offers compactness, space efficiency, and reduced weight, making it ideal for portable and space-constrained applications.

Maximum Operating Temperature

105 °C - The high maximum operating temperature ensures the power management IC can withstand harsh operating environments, enhancing its durability and reliability.

Minimum Operating Temperature

40 °C - The low minimum operating temperature allows the power management IC to operate reliably even in extremely cold conditions, expanding its usability.

Terminal Finish

Tin/Lead (Sn80Pb20) - The tin/lead terminal finish provides excellent solderability and ensures reliable electrical connections, facilitating smooth assembly and reducing potential issues.

Terminal Position

DUAL - The dual terminal position offers flexibility in circuit board design and allows for improved thermal dissipation, enhancing overall performance.

Maximum Seated Height

1.1 mm - The low maximum seated height allows for a compact overall design, enabling space-saving and greater flexibility in various applications.

Width (mm)

3 mm - The small width dimension of 3mm contributes to the overall compactness and compatibility of the power management IC, making it suitable for miniaturized electronic devices.

Other IC type

POWER SUPPLY SUPPORT CIRCUIT - This power management IC serves as a reliable and efficient support circuit for power supplies, contributing to stable and high-quality power delivery.

Minimum Supply Voltage (Vsup)

2 V - The minimum supply voltage requirement of 2V allows for compatibility with various power sources, widening the range of applications.

Maximum Time At Peak Reflow Temperature (s)

30 - The maximum time allowed at peak reflow temperature ensures proper soldering and reliable connections during manufacturing, reducing potential failures.

Peak Reflow Temperature °C

235 - The high peak reflow temperature capability enables the power management IC to withstand industry-standard soldering processes, ensuring a robust assembly.

Length

3 mm - The compact length of 3mm contributes to the overall miniaturization and space-saving potential of the power management IC.

Temperature Grade

INDUSTRIAL - The industrial temperature grade indicates that this power management IC is suitable for operation in rugged industrial environments, enhancing its reliability and versatility.

Maximum Supply Current (Isup)

0.9 mA - The low maximum supply current ensures energy efficiency and helps minimize power consumption, making it suitable for battery-operated devices.

No. of Channels

2 - The availability of dual channels allows for enhanced functionality and compatibility with multi-channel systems, expanding its range of applications.

Technology

BIPOLAR - The bipolar technology employed in this power management IC ensures excellent performance, reliability, and precision in voltage regulation and power management.

Terminal Form

GULL WING - The gull wing terminal form provides mechanical strength, easy soldering, and solid electrical connections, ensuring stable performance even in demanding environments.

Terminal Pitch

0.65 mm - The small terminal pitch of 0.65mm enables compatibility with densely populated circuit boards, facilitating high-density integration and space-saving.

Maximum Supply Voltage (Vsup)

40 V - The high maximum supply voltage capability of 40V allows for compatibility with a wide range of power sources, catering to diverse applications.

Technical Specifications

Power Management ICs MC33161DMR2 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

MINIMUM SUPPLY NEEDED FOR NEGATIVE SENSING IS 4V

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e0

Length:

3 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.9 mA

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn80Pb20)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

MC33161DMR2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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