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MC33064SN-5T1

Onsemi

MC33064SN-5T1 by Onsemi

MC33064SN-5T1 by Onsemi is a Power Management IC with 5V power supply, 4V nominal voltage, and -40 to 85 °C operating temperature range. It is used in industrial applications for power supply support circuits due to its small outline package and thin profile design.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 8,606 parts In-Stock

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Digiode

USA . 177 parts In-Stock

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AZTECH Wire

Italy . 557 parts In-Stock

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$12.660

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557

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Component Stockers USA

USA . 412 parts In-Stock

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$99.990

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Kulean Microsystems

USA . 4,747 parts In-Stock

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TANS Electronics

Latvia . 3,668 parts In-Stock

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Problanco Electronics

Mexico . 2,472 parts In-Stock

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SupplyDigital Components

Austria . 1,188 parts In-Stock

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UHIMA Technologies

Türkiye . 797 parts In-Stock

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Corohmni

South Africa . 237 parts In-Stock

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Microchip USA

USA . 215 parts In-Stock

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Corphita

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Overview

Unleash the power of your devices with the MC33064SN-5T1 by Onsemi. This high-quality Power Management IC offers reliable performance, advanced technology, and industrial-grade durability. Perfect for a wide range of applications, this product ensures optimal power supply support without compromising on efficiency. Experience the superior value and benefits that Onsemi brings to the table with the MC33064SN-5T1, setting new standards in power management solutions. Upgrade your devices today and see the difference for yourself!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the IC, ensuring longevity and reliability.

Surface Mount: YES

Surface mount design allows for easy and efficient installation on PCBs, saving space and facilitating automated assembly processes.

Nominal Supply Voltage (Vsup): 4 V

Optimal supply voltage of 4V ensures stable performance and efficiency of the power management IC.

No. of Terminals: 5

Having 5 terminals provides flexibility in connecting the IC to other components, allowing for versatile usage scenarios.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85 °C ensures reliable operation even in demanding environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40 °C enables the IC to function in a wide range of temperature settings, enhancing its usability.

Technology: BIPOLAR

Bipolar technology offers high performance and efficiency, making this power management IC suitable for various power supply support applications.

Technical Specifications

Power Management ICs MC33064SN-5T1 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e0

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.5 mA

Maximum Supply Voltage (Vsup):

6.5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

4 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.6V

Width (mm):

1.5 mm

Trade Compliance

MC33064SN-5T1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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