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MC33033PG

Onsemi

MC33033PG by Onsemi

MC33033PG by Onsemi is a Motion Control IC with 20V nominal voltage, 10-30V supply range, and 0.1A max output current. Ideal for industrial applications requiring brushless DC motor control in a compact rectangular package style. Operating temperature range from -40 to 85 °C makes it suitable for various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,194 parts In-Stock

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Digiode

USA . 224 parts In-Stock

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Speed Components Ltd

Israel . 62 parts In-Stock

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AZTECH Wire

Italy . 61 parts In-Stock

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$8.180

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Microchip USA

USA . 7,272 parts In-Stock

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Problanco Electronics

Mexico . 3,238 parts In-Stock

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TANS Electronics

Latvia . 2,261 parts In-Stock

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Kulean Microsystems

USA . 2,231 parts In-Stock

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SupplyDigital Components

Austria . 1,867 parts In-Stock

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Corphita

USA . 1,348 parts In-Stock

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UHIMA Technologies

Türkiye . 950 parts In-Stock

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Corohmni

South Africa . 147 parts In-Stock

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Overview

Enhance your motion control applications with the MC33033PG by Onsemi. This high-quality motion control IC offers unparalleled performance and reliability, thanks to Onsemi's outstanding reputation in the industry. Whether you're looking to optimize your brushless DC motor controller or enhance your industrial-grade technology, this product is the perfect solution. With a wide range of benefits and advantages, including precise control and efficient power supplies, the MC33033PG will take your projects to the next level. Experience the difference with Onsemi's innovative motion control ICs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and lightweight, making the product suitable for various applications while ensuring reliability.

Nominal Supply Voltage (Vsup): 20 V

The 20V supply voltage allows for efficient power usage and compatibility with a wide range of systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this product can withstand demanding industrial environments without sacrificing performance.

Technology: BIPOLAR

The bipolar technology used in this product provides precise control and accurate operation, making it a reliable choice for motion control applications.

Technical Specifications

Motion Control ICs MC33033PG attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

Length:

26.415 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

20

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

22 mA

Maximum Supply Voltage (Vsup):

30 V

Minimum Supply Voltage (Vsup):

10 V

Nominal Supply Voltage (Vsup):

20 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

MC33033PG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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