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MC33030PG

Onsemi

MC33030PG by Onsemi

MC33030PG by Onsemi is a 16-terminal motion control IC with a max output current of 1A. Operating b/w -40 to 85 °C, it's ideal for industrial applications requiring brush DC motor control. The rectangular plastic/epoxy package measures 19.4mm in length, 7.62mm in width, and has a seated height of 4.69mm.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 5,185 parts In-Stock

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Chip Stock

USA . 3,495 parts In-Stock

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Digiode

USA . 535 parts In-Stock

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535

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AZTECH Wire

Italy . 140 parts In-Stock

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$8.970

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QUARKTWIN TECHNOLOGY LTD

USA . 23,120 parts In-Stock

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SupplyDigital Components

Austria . 7,728 parts In-Stock

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Kulean Microsystems

USA . 6,411 parts In-Stock

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TANS Electronics

Latvia . 4,122 parts In-Stock

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Problanco Electronics

Mexico . 3,138 parts In-Stock

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Kepictronics

USA . 2,000 parts In-Stock

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Corphita

USA . 650 parts In-Stock

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Microchip USA

USA . 348 parts In-Stock

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Corohmni

South Africa . 277 parts In-Stock

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UHIMA Technologies

Türkiye . 27 parts In-Stock

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Overview

Discover the power and precision of the MC33030PG by Onsemi, a cutting-edge Motion Control IC designed to revolutionize your applications. Crafted with high-quality materials and advanced technology, this product offers unparalleled performance and reliability. Ideal for brush DC motor control, this IC boasts a wide operating temperature range and a maximum output current of 1A, making it perfect for industrial-grade projects. Elevate your designs with the MC33030PG and experience the superior quality and value that Onsemi is known for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components of the IC, ensuring durability and reliability.

Nominal Supply Voltage (Vsup): 14 V

The high supply voltage allows for efficient operation of the motion control IC, making it suitable for powering various motor types.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this motion control IC can withstand harsh environmental conditions and maintain stable performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable operation in cold environments, making this IC suitable for a wide range of applications.

Maximum Output Current: 1 A

This high maximum output current capability makes the motion control IC suitable for driving a wide range of motors with different power requirements.

Technical Specifications

Motion Control ICs MC33030PG attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

Length:

19.4 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

4.69 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

9 V

Nominal Supply Voltage (Vsup):

14 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

MC33030PG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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