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MC14555BF

Onsemi

MC14555BF by Onsemi

MC14555BF by Onsemi is a CMOS Decoder & Driver with 440 ns Propagation Delay at 5V. It has 2 functions, operates b/w -55 to 125 °C, and supports load capacitance of 50 pF. Ideal for military applications due to its small outline package style and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,103 parts In-Stock

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Vyrian

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TANS Electronics

Latvia . 5,190 parts In-Stock

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Problanco Electronics

Mexico . 3,313 parts In-Stock

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SupplyDigital Components

Austria . 2,637 parts In-Stock

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Corphita

USA . 1,704 parts In-Stock

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Microchip USA

USA . 1,557 parts In-Stock

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Kulean Microsystems

USA . 1,132 parts In-Stock

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Corohmni

South Africa . 467 parts In-Stock

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UHIMA Technologies

Türkiye . 406 parts In-Stock

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Overview

Unlock a world of possibilities with the MC14555BF decoder & driver by Onsemi. Crafted with precision and expertise, this product boasts unparalleled quality and reliability. Perfect for a wide range of applications, this decoder offers superior performance and efficiency. With a sleek design and advanced technology, it delivers exceptional value to customers seeking cutting-edge solutions. Experience the advantages of Onsemi's innovative products and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Propagation Delay At Nominal Supply: 440 ns

The low propagation delay ensures fast signal processing, making the product suitable for high-speed applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient PCB assembly, saving time and cost during manufacturing.

Nominal Supply Voltage / Vsup (V): 5

The product is designed to operate at a standard 5V supply voltage, making it compatible with a wide range of electronic systems.

Load Capacitance (CL): 50 pF

The low load capacitance minimizes power consumption and interference, enhancing the overall efficiency of the product.

Maximum Operating Temperature: 125 °C

The high operating temperature range makes the product suitable for use in extreme environmental conditions, ensuring reliability and performance.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Decoder & Drivers MC14555BF attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

4000/14000/40000

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

.64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

440 ns

Propagation Delay (tpd):

440 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC14555BF Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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