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MC14513BCPG

Onsemi

MC14513BCPG by Onsemi

MC14513BCPG by Onsemi is a CMOS Decoder & Drivers with 18 terminals. It operates at 5V nominal voltage and has latched input conditioning. With a propagation delay of 1440ns, it is suitable for military-grade applications requiring true output polarity control.

Median Price

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Lifecycle Status

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Vyrian

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AZTECH Wire

Italy . 703 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 25,943 parts In-Stock

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TANS Electronics

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Kulean Microsystems

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Microchip USA

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SupplyDigital Components

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Perfect Parts

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UHIMA Technologies

Türkiye . 795 parts In-Stock

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Corohmni

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Overview

Enhance your electronic projects with the MC14513BCPG by Onsemi, a high-quality decoder & driver that offers precise and reliable performance. Manufactured by Onsemi, a trusted name in the industry, this product is designed to meet the demanding needs of various applications. With its latched input conditioning and true output polarity, the MC14513BCPG ensures smooth operation and seamless integration. Experience the value and benefits of this product, from its compact design to its wide operating temperature range. Trust Onsemi for superior quality and unmatched innovation in electronic components.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the decoder & driver, ensuring a longer lifespan.

Input Conditioning: LATCHED

The latched input conditioning helps in maintaining the stability of the input signals, reducing the risk of errors or signal fluctuations.

Nominal Supply Voltage / Vsup (V): 5

Stable supply voltage of 5V ensures consistent performance and reliability of the decoder & driver.

Propagation Delay (tpd): 1440 ns

Low propagation delay ensures quick response time and efficient signal processing in the decoder & driver.

Maximum Operating Temperature: 125 °C

High maximum operating temperature tolerance allows the decoder & driver to function effectively even in harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the decoder & driver energy-efficient and reliable.

Technical Specifications

Decoder & Drivers MC14513BCPG attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

4000/14000/40000

Input Conditioning:

LATCHED

JESD-30 Code:

R-PDIP-T18

JESD-609 Code:

e3

Length:

22.73 mm

No. of Functions:

1

No. of Terminals:

18

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP18,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay (tpd):

1440 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MC14513BCPG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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