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MC14067BCPG

Onsemi

MC14067BCPG by Onsemi

MC14067BCPG by Onsemi is a CMOS single-ended multiplexer with 16 channels. It operates at a supply voltage range of 3-18V and offers a max on-state resistance of 1050 ohm. With MILITARY grade temperature tolerance, it is ideal for applications requiring precise signal routing in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,817 parts In-Stock

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Digiode

USA . 1,532 parts In-Stock

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AZTECH Wire

Italy . 484 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 8,796 parts In-Stock

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SupplyDigital Components

Austria . 6,990 parts In-Stock

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Kulean Microsystems

USA . 5,346 parts In-Stock

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Kepictronics

USA . 3,845 parts In-Stock

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Metaverse IC Inc.

Canada . 3,233 parts In-Stock

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TANS Electronics

Latvia . 3,005 parts In-Stock

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Problanco Electronics

Mexico . 1,716 parts In-Stock

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Corphita

USA . 1,332 parts In-Stock

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S.R.D Solutions

India . 900 parts In-Stock

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UHIMA Technologies

Türkiye . 879 parts In-Stock

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Corohmni

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Microchip USA

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Overview

Experience seamless signal routing and efficient data processing with the MC14067BCPG by Onsemi. This high-quality multiplexer, known for its reliability and precision, is designed to meet the demands of various applications in industries such as telecommunications, automation, and instrumentation. With a wide supply voltage range and low power consumption, this product offers exceptional value and performance, making it the ideal choice for customers seeking superior functionality and durability. Upgrade your systems with the MC14067BCPG and elevate your operations to new heights of efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for various applications.

Nominal Supply Voltage (Vsup): 5 V

Operating at a nominal supply voltage of 5V makes the product compatible with standard power sources, ensuring easy integration into existing systems.

No. of Channels: 16

Having 16 channels allows for multiple signal inputs to be processed simultaneously, increasing the product's versatility and efficiency.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, the product can withstand harsh environmental conditions, making it suitable for industrial applications.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, ensuring reliable performance and energy efficiency.

Technical Specifications

Multiplexers & Switches MC14067BCPG attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T24

JESD-609 Code:

e3

Length:

31.75 mm

No. of Channels:

16

No. of Functions:

1

No. of Terminals:

24

Nominal Off-state Isolation:

40 dB

Nominal On-state Resistance Match:

25 ohm

Maximum On-state Resistance (Ron):

1050 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Signal Current:

.025 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.6 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Maximum Switch-off Time:

625 ns

Maximum Switch-on Time:

600 ns

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

15.24 mm

Trade Compliance

MC14067BCPG Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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