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MC14051BDTR2

Onsemi

MC14051BDTR2 by Onsemi

MC14051BDTR2 by Onsemi is a CMOS single-ended multiplexer with 8 channels. It operates at a supply voltage range of 3-18V and offers a max on-state resistance of 1050 ohm. With a compact design and military-grade temperature tolerance, it is ideal for applications requiring precise signal switching in harsh environments.

Median Price

$0.120

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,505 parts In-Stock

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$0.120

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$0.120

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$0.120

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3,505

$0.120

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$0.120

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Chip Stock

USA . 90,707 parts In-Stock

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Vyrian

USA . 4,625 parts In-Stock

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Digiode

USA . 1,607 parts In-Stock

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Semtec, LLC

USA . 745 parts In-Stock

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Ampacity Inc.

Singapore . 1,218 parts In-Stock

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$3.500

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AZTECH Wire

Italy . 479 parts In-Stock

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$18.250

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SupplyDigital Components

Austria . 7,605 parts In-Stock

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TANS Electronics

Latvia . 6,381 parts In-Stock

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Microchip USA

USA . 4,998 parts In-Stock

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USA . 4,500 parts In-Stock

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Kulean Microsystems

USA . 2,575 parts In-Stock

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Problanco Electronics

Mexico . 1,648 parts In-Stock

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ChipstoGo Electronic ltd

UK . 970 parts In-Stock

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UHIMA Technologies

Türkiye . 621 parts In-Stock

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Corohmni

South Africa . 205 parts In-Stock

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Corphita

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Kepictronics

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Overview

Discover the MC14051BDTR2 by Onsemi, a top-of-the-line multiplexer with unparalleled quality and reliability. Manufactured by Onsemi, a leading name in the industry, this versatile product is perfect for a wide range of applications. From its durable plastic/epoxy body to its seamless surface mount design, this multiplexer offers customers unbeatable value and efficiency. With a nominal supply voltage of 5V and military-grade temperature specifications, the MC14051BDTR2 ensures optimal performance in any environment. Upgrade your systems with this cutting-edge solution today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability for the product.

Surface Mount: YES

Allows for easy installation and space-saving on PCBs.

Nominal Supply Voltage (Vsup): 5 V

Compatible with common voltage standards in electronic devices.

No. of Terminals: 16

Provides versatility and connectivity options for various applications.

Maximum Operating Temperature: 125 °C

Ensures stable performance even in high-temperature environments.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high speed operation.

Technical Specifications

Multiplexers & Switches MC14051BDTR2 attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

8

No. of Functions:

1

No. of Terminals:

16

Nominal Off-state Isolation:

50 dB

Nominal On-state Resistance Match:

70 ohm

Maximum On-state Resistance (Ron):

1050 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Signal Current:

.025 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Maximum Switch-off Time:

700 ns

Maximum Switch-on Time:

700 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

MC14051BDTR2 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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