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MAX810SQ293D2T1G

Onsemi

MAX810SQ293D2T1G by Onsemi

MAX810SQ293D2T1G by Onsemi is a Power Management IC with 3.3V nominal voltage, suitable for industrial applications. It features a small outline package style, very thin profile, and shrink pitch design. With a max operating temperature of 105 °C and dual terminal position, it offers reliable power supply support in compact systems.

Median Price

$0.259

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

$0.259

1k+ parts

$0.215

10k+ parts

$0.192

3,000

-

$0.259

$0.215

$0.192

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 15,000 parts In-Stock

1+ parts

-

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-

1k+ parts

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15,000

-

-

-

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Chip Stock

USA . 7,500 parts In-Stock

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7,500

-

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-

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NAC Semi

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

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$0.284

6,000

-

-

-

$0.284

Vyrian

USA . 2,854 parts In-Stock

1+ parts

-

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2,854

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Digiode

USA . 349 parts In-Stock

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349

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 6,068 parts In-Stock

1+ parts

$0.630

100+ parts

$0.380

1k+ parts

$0.230

10k+ parts

-

6,068

$0.630

$0.380

$0.230

-

Microchip USA

USA . 4,964 parts In-Stock

1+ parts

$1.557

100+ parts

-

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4,964

$1.557

-

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AZTECH Wire

Italy . 716 parts In-Stock

1+ parts

$8.990

100+ parts

-

1k+ parts

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10k+ parts

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716

$8.990

-

-

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$24.741

100+ parts

$22.514

1k+ parts

$20.288

10k+ parts

-

3,000

$24.741

$22.514

$20.288

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QUARKTWIN TECHNOLOGY LTD

USA . 20,349 parts In-Stock

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20,349

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SupplyDigital Components

Austria . 5,746 parts In-Stock

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5,746

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Corphita

USA . 2,229 parts In-Stock

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2,229

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Perfect Parts

USA . 2,072 parts In-Stock

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2,072

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Kulean Microsystems

USA . 1,525 parts In-Stock

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1,525

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Problanco Electronics

Mexico . 1,139 parts In-Stock

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1,139

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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UHIMA Technologies

Türkiye . 728 parts In-Stock

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728

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TANS Electronics

Latvia . 491 parts In-Stock

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491

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Corohmni

South Africa . 367 parts In-Stock

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367

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Overview

Unlock the power of reliable and efficient power management with the MAX810SQ293D2T1G by Onsemi. This high-quality Power Management IC offers a seamless integration into various applications, providing a stable supply voltage of 3.3V for optimal performance. With its advanced technology and industrial-grade temperature tolerance, this product ensures long-lasting durability and consistent output. Experience the convenience and peace of mind that comes with choosing Onsemi, a trusted manufacturer known for delivering superior products that exceed expectations. Elevate your projects with the MAX810SQ293D2T1G and enjoy the benefits of top-notch quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection and durability for the Power Management IC.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards, saving space and improving manufacturing efficiency.

Nominal Supply Voltage (Vsup): 3.3 V

Suitable voltage for various electronic devices, providing stable power supply.

Power Supplies (V): 1/5.5

Wide operating range of power supplies allows flexibility in various applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC energy-efficient and reliable.

Technical Specifications

Power Management ICs MAX810SQ293D2T1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.93V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Length:

2.1 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOT-323

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1/5.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0025 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.93V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.24 mm

Trade Compliance

MAX810SQ293D2T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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