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LV8549M-TLM-H

Onsemi

LV8549M-TLM-H by Onsemi

LV8549M-TLM-H by Onsemi is a Motion Control IC with 12V supply voltage, 10 terminals, and BICMOS technology. It operates b/w -30 to 85 °C and has a max supply current of 2.3 mA. Ideal for applications requiring precise motion control in compact designs.

Median Price

$2.062

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 542 parts In-Stock

1+ parts

-

100+ parts

$1.950

1k+ parts

$1.740

10k+ parts

$1.640

542

-

$1.950

$1.740

$1.640

Verical

USA . 542 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.175

10k+ parts

$2.050

542

-

-

$2.175

$2.050

Distributors (In-Stock)

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Digiode

USA . 1,843 parts In-Stock

1+ parts

$2.042

100+ parts

-

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-

1,843

$2.042

-

-

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Vyrian

USA . 5,611 parts In-Stock

1+ parts

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5,611

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Chip Stock

USA . 1,125 parts In-Stock

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1,125

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

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50

-

-

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-

Distributors (Availability)

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Corphita

USA . 2,315 parts In-Stock

1+ parts

$1.935

100+ parts

-

1k+ parts

-

10k+ parts

-

2,315

$1.935

-

-

-

Continental Prestige Electronics

USA . 542 parts In-Stock

1+ parts

$2.150

100+ parts

$1.220

1k+ parts

-

10k+ parts

-

542

$2.150

$1.220

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-

Corohmni

South Africa . 102 parts In-Stock

1+ parts

$2.150

100+ parts

-

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102

$2.150

-

-

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Ampacity Inc.

Singapore . 361 parts In-Stock

1+ parts

$3.980

100+ parts

-

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361

$3.980

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Aztec Data Supply Inc.

USA . 3,194 parts In-Stock

1+ parts

$9.186

100+ parts

-

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3,194

$9.186

-

-

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AZTECH Wire

Italy . 994 parts In-Stock

1+ parts

$11.580

100+ parts

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994

$11.580

-

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SupplyDigital Components

Austria . 7,001 parts In-Stock

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7,001

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TANS Electronics

Latvia . 5,119 parts In-Stock

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5,119

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Argo Parts USA

USA . 3,442 parts In-Stock

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3,442

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Kulean Microsystems

USA . 2,668 parts In-Stock

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2,668

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

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2,000

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Problanco Electronics

Mexico . 1,456 parts In-Stock

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1,456

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UHIMA Technologies

Türkiye . 877 parts In-Stock

1+ parts

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877

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Microchip USA

USA . 136 parts In-Stock

1+ parts

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136

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Overview

Enhance your motion control projects with the LV8549M-TLM-H by Onsemi. Crafted with precision and expertise, Onsemi delivers top-notch quality and reliability in their products. The LV8549M-TLM-H falls under the category of Motion Control ICs, offering seamless integration and superior performance. With a nominal supply voltage of 12V and a compact package body material, this IC is designed to optimize efficiency and functionality. Experience smooth operation and enhanced control with the LV8549M-TLM-H, unlocking a world of possibilities for your motion control applications. Elevate your projects today with this exceptional product from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the product lightweight and durable, perfect for applications where weight and durability are important factors.

Surface Mount: YES

Being surface mount compatible allows for easy and efficient assembly onto circuit boards, saving time and effort during manufacturing.

Nominal Supply Voltage (Vsup): 12 V

The 12V nominal supply voltage ensures compatibility with a wide range of applications, making it versatile and suitable for various projects.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high heat environments, ensuring reliable performance in various conditions.

Technology: BICMOS

The BICMOS technology used in this product offers a combination of benefits from both bipolar and CMOS technologies, providing a balance of speed, power consumption, and noise immunity.

Technical Specifications

Motion Control ICs LV8549M-TLM-H attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP10,.25,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

12

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

2.3 mA

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

GULL WING

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Trade Compliance

LV8549M-TLM-H Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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