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LV8549MC

Onsemi

LV8549MC by Onsemi

LV8549MC by Onsemi is a Motion Control IC with 10 terminals, BICMOS technology, and 4-16V supply voltage range. It is a Stepper Motor Controller in a small outline package suitable for applications requiring precise motion control at temperatures from -30 to 85 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 806 parts In-Stock

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Vyrian

USA . 359 parts In-Stock

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359

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Problanco Electronics

Mexico . 7,793 parts In-Stock

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7,793

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Kulean Microsystems

USA . 7,144 parts In-Stock

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SupplyDigital Components

Austria . 5,981 parts In-Stock

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TANS Electronics

Latvia . 1,991 parts In-Stock

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Corphita

USA . 1,052 parts In-Stock

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UHIMA Technologies

Türkiye . 717 parts In-Stock

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717

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Corohmni

South Africa . 344 parts In-Stock

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Overview

Unlock unparalleled precision and efficiency with the LV8549MC by Onsemi, a leading manufacturer of top-quality Motion Control ICs. Perfect for applications requiring precise control, this stepper motor controller offers unmatched value and performance. With a compact design and advanced technology, this product ensures seamless operation in various environments. Trust Onsemi to deliver cutting-edge solutions that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good thermal and mechanical properties, making the IC durable and reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy PCB assembly and saves space on the board, making the overall design more compact.

Nominal Supply Voltage (Vsup): 12 V

Operating at a nominal supply voltage of 12V allows for compatibility with a wide range of power sources, providing flexibility in application.

Technology: BICMOS

Utilizing BICMOS technology ensures high performance and power efficiency, making the IC suitable for demanding motion control applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the IC can operate reliably in harsh environments without overheating.

Technical Specifications

Motion Control ICs LV8549MC attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G10

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

LV8549MC Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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