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LV5683P

Onsemi

LV5683P by Onsemi

LV5683P by Onsemi is a Power Management IC with 15 terminals, operating from -40 to 85 °C. It supports 4 channels and has a supply voltage range of 7-16V. Ideal for industrial applications requiring power supply support circuits in a rectangular package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

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Digiode

USA . 851 parts In-Stock

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SupplyDigital Components

Austria . 5,183 parts In-Stock

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Problanco Electronics

Mexico . 4,317 parts In-Stock

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Kulean Microsystems

USA . 2,924 parts In-Stock

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TANS Electronics

Latvia . 1,814 parts In-Stock

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Corphita

USA . 1,697 parts In-Stock

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UHIMA Technologies

Türkiye . 474 parts In-Stock

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Corohmni

South Africa . 417 parts In-Stock

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Overview

Enhance the performance of your power management systems with the LV5683P by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their products. The LV5683P is designed to provide efficient power supply support for various applications, offering customers unparalleled value and benefits. With its industrial-grade temperature tolerance and innovative design, this Power Management IC is the perfect choice for your projects. Trust Onsemi to deliver excellence in every component.

Feature Benefit Bullets

Package Shape: RECTANGULAR

The rectangular shape allows for easy and convenient installation in various electronic devices.

Nominal Supply Voltage: 14.4 V

Provides a stable power supply at an optimal voltage for the device's operation.

No. of Terminals: 15

Offers versatility in connecting multiple components for power management within the device.

Package Style (Meter): FLANGE MOUNT

Enables secure mounting and easy integration into the overall design of the electronic system.

Maximum Operating Temperature: 85 °C

Allows for reliable performance even in high-temperature environments.

Minimum Operating Temperature: -40 °C

Ensures functionality in extreme cold conditions, making it suitable for a wide range of applications.

Terminal Position: ZIG-ZAG

Facilitates efficient routing of connections and reduces the risk of short circuits.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed specifically to provide support for power supply functions, ensuring stable and efficient power delivery.

Minimum Supply Voltage: 7 V

Allows for operation even at lower voltage levels, providing flexibility in power source options.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications where temperature variations are common, ensuring durability and reliability.

No. of Channels: 4

Provides multiple channels for power management, allowing for more control and customization of the power distribution.

Terminal Form: THROUGH-HOLE

Enables easy and secure soldering onto the PCB, ensuring robust connections for stable power delivery.

Maximum Supply Voltage: 16 V

Can handle higher voltage levels without issues, offering a safety margin for power fluctuations.

Technical Specifications

Power Management ICs LV5683P attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-XZFM-T15

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

15

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

7 V

Nominal Supply Voltage (Vsup):

14.4 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Position:

ZIG-ZAG

Trade Compliance

LV5683P Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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