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LV56351JA-ZH

Onsemi

LV56351JA-ZH by Onsemi

LV56351JA-ZH by Onsemi is a 20-terminal switching regulator with BICMOS technology. It operates b/w -30 °C to 85°C, in voltage-mode control. The small outline package makes it suitable for various applications requiring precise voltage regulation.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,603 parts In-Stock

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6,603

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Digiode

USA . 2,240 parts In-Stock

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2,240

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Distributors (Availability)

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AZTECH Wire

Italy . 565 parts In-Stock

1+ parts

$15.580

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565

$15.580

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QUARKTWIN TECHNOLOGY LTD

USA . 13,426 parts In-Stock

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Microchip USA

USA . 5,383 parts In-Stock

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SupplyDigital Components

Austria . 5,275 parts In-Stock

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5,275

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Problanco Electronics

Mexico . 3,287 parts In-Stock

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TANS Electronics

Latvia . 3,167 parts In-Stock

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Corphita

USA . 2,120 parts In-Stock

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Kulean Microsystems

USA . 1,021 parts In-Stock

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Corohmni

South Africa . 474 parts In-Stock

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UHIMA Technologies

Türkiye . 252 parts In-Stock

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Overview

Discover the innovative LV56351JA-ZH by Onsemi, a top-of-the-line switching regulator that promises unmatched quality and reliability. As a leading manufacturer in the industry, Onsemi delivers cutting-edge technology and superior performance in every product. Ideal for a wide range of applications, this regulator offers customers incredible value and benefits, from efficient power management to enhanced control capabilities. Experience the advantages of Onsemi's expertise with the LV56351JA-ZH, where quality meets innovation for unparalleled results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components, ensuring a longer product lifespan.

Surface Mount: YES

Being surface mountable makes the product easy to integrate into PCBs, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient placement on the PCB and optimal use of board space.

No. of Terminals: 20

Having a higher number of terminals allows for more connections and flexibility in design and circuit implementation.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style further contributes to space-saving on the PCB and efficient layout design.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliable performance even in demanding environmental conditions.

Control Mode: VOLTAGE-MODE

Voltage-mode control provides precise regulation of output voltages, enhancing stability and efficiency in power delivery.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature allows the product to function effectively in a wide range of temperature environments.

Terminal Finish: Tin/Bismuth (Sn/Bi)

The tin/bismuth terminal finish offers good solderability and corrosion resistance, ensuring reliable connections and long-term performance.

Terminal Position: DUAL

Having dual terminal positions provides flexibility in PCB layout and allows for different mounting orientations.

Technology: BICMOS

The BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high-speed operation with low power consumption.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and rework, making the product more user-friendly during assembly and maintenance.

Terminal Pitch: 0.635 mm

The small terminal pitch allows for compact design and closer spacing of components, enabling higher circuit density and efficiency.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that the product has a moderate level of moisture sensitivity, suitable for standard PCB assembly processes.

Technical Specifications

Switching Regulators & Controllers LV56351JA-ZH attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Control Mode:

VOLTAGE-MODE

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

LV56351JA-ZH Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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