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LV5603T

Onsemi

LV5603T by Onsemi

LV5603T by Onsemi is a voltage-mode switching regulator with a max operating temperature of 85 °C and a max switching frequency of 520 kHz. This BICMOS technology device comes in a square flatpack package with 48 terminals, making it ideal for high-frequency power conversion applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,008 parts In-Stock

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Digiode

USA . 603 parts In-Stock

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603

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SupplyDigital Components

Austria . 7,302 parts In-Stock

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Kulean Microsystems

USA . 4,318 parts In-Stock

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Problanco Electronics

Mexico . 3,135 parts In-Stock

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TANS Electronics

Latvia . 3,123 parts In-Stock

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Corphita

USA . 786 parts In-Stock

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Corohmni

South Africa . 383 parts In-Stock

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UHIMA Technologies

Türkiye . 242 parts In-Stock

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Overview

Discover the innovative LV5603T by Onsemi, a top-quality switching regulator and controller designed to deliver reliable performance in a compact package. Manufactured by industry leader Onsemi, this product offers unmatched efficiency and precision for a wide range of applications. With its cutting-edge technology and advanced features, the LV5603T provides exceptional value and benefits to customers, making it the ideal choice for your power management needs. Experience the difference with Onsemi's LV5603T today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability for the product, making it suitable for a variety of applications.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time during manufacturing.

Package Shape: SQUARE

Enables compact and space-saving design for the product, ideal for applications with limited space.

No. of Terminals: 48

Offers flexibility and versatility in connections, allowing for a wide range of system configurations.

Package Style (Meter): FLATPACK

Enhances thermal performance and heat dissipation, ensuring optimal operation of the product.

Maximum Operating Temperature: 85 °C

Ensures reliable performance in a variety of environmental conditions, suitable for various applications.

Control Mode: VOLTAGE-MODE

Provides precise control over the output voltage, enabling efficient power management for the product.

Minimum Operating Temperature: -30 °C

Allows for operation in extreme low temperature conditions, expanding the range of applications for the product.

Terminal Position: QUAD

Facilitates easy connections and soldering during assembly, simplifying the manufacturing process.

Maximum Switching Frequency: 520 kHz

Enables high-speed operation and efficiency, making the product suitable for demanding applications.

Technology: BICMOS

Combines the advantages of bipolar and CMOS technologies, providing high performance and low power consumption for the product.

Terminal Form: GULL WING

Ensures secure and reliable connections on the circuit board, reducing the risk of errors or malfunctions.

Terminal Pitch: 0.5 mm

Offers precise alignment and placement of terminals, enhancing the overall quality and reliability of the product.

Technical Specifications

Switching Regulators & Controllers LV5603T attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Control Mode:

VOLTAGE-MODE

JESD-30 Code:

S-PQFP-G48

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

TQFP48,.35SQ

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Maximum Switching Frequency:

520 kHz

Technology:

BICMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LV5603T Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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