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LC79451KB-X2T

Onsemi

LC79451KB-X2T by Onsemi

LC79451KB-X2T by Onsemi is a CMOS Interface IC with 128 segments for SEGMENT display mode. It operates b/w -30 to 80 °C, with supply voltage range of 1.6V to 3.6V. Suitable for applications requiring commercial extended temperature grade and surface mount installation.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Chip Stock

USA . 72,000 parts In-Stock

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Vyrian

USA . 8,452 parts In-Stock

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Digiode

USA . 1,615 parts In-Stock

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1,615

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Distributors (Availability)

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AZTECH Wire

Italy . 158 parts In-Stock

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$16.210

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158

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Ampacity Inc.

Singapore . 909 parts In-Stock

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$30.500

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909

$30.500

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Kulean Microsystems

USA . 8,346 parts In-Stock

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Problanco Electronics

Mexico . 5,113 parts In-Stock

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TANS Electronics

Latvia . 3,330 parts In-Stock

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Corphita

USA . 2,260 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Microchip USA

USA . 296 parts In-Stock

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296

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UHIMA Technologies

Türkiye . 207 parts In-Stock

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Corohmni

South Africa . 68 parts In-Stock

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SupplyDigital Components

Austria . 26 parts In-Stock

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Overview

Enhance your electronic devices with the LC79451KB-X2T by Onsemi, a top-tier manufacturer known for their high-quality products. This Interface IC is designed to meet various applications in the market, providing seamless performance and reliability. With a wide range of benefits such as low power consumption and extended temperature grade, this chip carrier package offers exceptional value for customers seeking top-notch solutions. Upgrade your devices today with the LC79451KB-X2T and experience cutting-edge technology at its finest.

Feature Benefit Bullets

Display Mode: SEGMENT

Segment display allows for clearer and more specific information to be displayed, making it easier for users to interpret.

Surface Mount: YES

Surface mount packaging saves space on the PCB and allows for more compact designs.

Maximum Supply Voltage: 3.6 V

Can handle higher supply voltages which may be necessary for certain applications or environments.

Package Shape: RECTANGULAR

Rectangular shape is versatile and easy to handle during assembly.

Power Supplies (V): 2.5,2.7

Multiple power supply options provide flexibility for different operating conditions.

No. of Terminals: 168

A higher number of terminals enable more connections and functionalities.

Package Style (Meter): CHIP CARRIER

Chip carrier package style is compact and provides efficient heat dissipation.

Minimum Supply Voltage: 1.6 V

Low minimum supply voltage allows for operation in low-power scenarios.

Maximum Operating Temperature: 80 °C

High maximum operating temperature ensures reliability in harsh environments.

Minimum Operating Temperature: -30 °C

Wide operating temperature range allows for use in extreme conditions.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB layout and assembly.

Width: 1.43 mm

Narrow width saves space on the PCB and allows for compact designs.

Length: 6.55 mm

Optimal length for handling and fitting into various electronic devices.

Temperature Grade: COMMERCIAL EXTENDED

Commercial extended temperature grade ensures reliable operation in industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: BUTT

Butt terminal form provides reliable connections and prevents signal loss.

Maximum Supply Current: 0.48 mA

Low maximum supply current helps conserve energy and reduce heat dissipation.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent performance.

No. of Segments: 128

A high number of segments allow for more detailed display information.

Interface IC Type: INTERFACE CIRCUIT

Interface circuit type enables communication with external devices and systems.

Technical Specifications

Other Function Interface ICs LC79451KB-X2T attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Display Mode:

SEGMENT

Interface IC Type:

JESD-30 Code:

R-XBCC-B168

Length:

6.55 mm

No. of Functions:

1

No. of Segments:

128

No. of Terminals:

168

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

UNSPECIFIED

Package Code:

BCC

Package Equivalence Code:

DIE OR CHIP

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

2.5,2.7

Qualification:

Not Qualified

Maximum Supply Current:

.48 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.6 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Width:

1.43 mm

Trade Compliance

LC79451KB-X2T Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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