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LC7942KD

Onsemi

LC7942KD by Onsemi

The Onsemi LC7942KD is a CMOS interface IC with 80 terminals in a flatpack package. It operates b/w -20 °C to 85°C, with power supplies of 3/5V. Ideal for segment display applications, it features gull wing terminals and supports surface mount installation.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,388 parts In-Stock

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Digiode

USA . 1,078 parts In-Stock

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1,078

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Distributors (Availability)

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Problanco Electronics

Mexico . 7,882 parts In-Stock

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7,882

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Kulean Microsystems

USA . 5,740 parts In-Stock

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5,740

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TANS Electronics

Latvia . 1,949 parts In-Stock

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SupplyDigital Components

Austria . 1,885 parts In-Stock

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Corphita

USA . 1,357 parts In-Stock

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Corohmni

South Africa . 485 parts In-Stock

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485

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UHIMA Technologies

Türkiye . 39 parts In-Stock

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Overview

Elevate your electronic designs with the LC7942KD by Onsemi. Known for its exceptional quality and reliability, Onsemi has been a trusted manufacturer in the industry for years. This versatile Other Function Interface IC is perfect for a wide range of applications, offering seamless integration and optimal performance. With its innovative design and advanced technology, the LC7942KD delivers unparalleled value and benefits to customers, making it the ideal choice for your next project. Experience the advantages of Onsemi's cutting-edge solutions with the LC7942KD today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material ensures long-term durability and reliability.

Display Mode: SEGMENT

Segment display mode provides clear and easy-to-read output.

Surface Mount: YES

Easy to install and saves space on the PCB.

Power Supplies (V): 3/5

Supports multiple voltage options for flexibility in integration.

No. of Terminals: 80

Sufficient terminals for connecting to various components and peripherals.

Package Style (Meter): FLATPACK

Flatpack style is compact and allows for efficient use of space on the PCB.

Maximum Operating Temperature: 85 °C

Can operate effectively in various temperature environments.

Minimum Operating Temperature: -20 °C

Can withstand low temperatures without losing functionality.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals make it easier to solder and create strong connections.

Technical Specifications

Other Function Interface ICs LC7942KD attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Display Mode:

SEGMENT

JESD-30 Code:

R-PQFP-G80

No. of Backplanes:

64-BP

No. of Segments:

0

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP80,.7X.9,32

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Maximum Supply Current:

.1 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Trade Compliance

LC7942KD Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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