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LC7941KDR

Onsemi

LC7941KDR by Onsemi

The Onsemi LC7941KDR is a CMOS interface IC with 80 segments, operating at -20 to 85 °C. It has a power supply of 3/5V and consumes up to 1mA current. Ideal for applications requiring segment display in a flatpack package with quad terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,960 parts In-Stock

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Vyrian

USA . 675 parts In-Stock

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675

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TANS Electronics

Latvia . 7,633 parts In-Stock

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7,633

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Problanco Electronics

Mexico . 5,402 parts In-Stock

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SupplyDigital Components

Austria . 3,519 parts In-Stock

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Kulean Microsystems

USA . 2,125 parts In-Stock

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Corphita

USA . 1,862 parts In-Stock

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UHIMA Technologies

Türkiye . 849 parts In-Stock

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849

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Corohmni

South Africa . 84 parts In-Stock

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Overview

Unleash the power of seamless connectivity and precision with the LC7941KDR by Onsemi. Crafted with utmost quality and expertise, this innovative product offers unmatched reliability and performance in the realm of Other Function Interface ICs. Perfect for a wide range of applications, from consumer electronics to industrial automation, this gem from Onsemi promises value-driven solutions that cater to your every need. Elevate your projects with the LC7941KDR and experience the advantage of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, perfect for various applications.

Display Mode: SEGMENT

The segment display mode allows for clear and easy-to-read information presentation, suitable for interface applications where specific data needs to be shown.

Surface Mount: YES

Being surface mountable, this product provides easy and efficient assembly on PCBs, saving space and reducing production cost.

Power Supplies (V): 3/5

With flexible power supply options of 3V and 5V, this product can be easily integrated into different systems without the need for external voltage converters.

No. of Terminals: 100

The high number of terminals allows for versatile connectivity options, enabling the product to interface with various components effectively.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the product's reliability and stability in demanding environmental conditions.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature range allows the product to perform efficiently even in cold environments without compromising performance.

Technology: CMOS

Using CMOS technology ensures low power consumption, high noise immunity, and compatibility with a wide range of digital systems, making the product energy-efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form provides increased solder joint reliability and mechanical strength, ensuring stable connections for long-term performance.

No. of Segments: 80

Having 80 segments offers the product versatility in displaying information, making it suitable for applications that require complex data visualization.

Technical Specifications

Other Function Interface ICs LC7941KDR attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Display Mode:

SEGMENT

JESD-30 Code:

R-PQFP-G100

No. of Segments:

80

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.7X.9

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Maximum Supply Current:

1 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Trade Compliance

LC7941KDR Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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