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LC78213

Onsemi

LC78213 by Onsemi

LC78213 by Onsemi is a CMOS multiplexer with 30 terminals, operating at temperatures from -30 °C to 70°C. It has a nominal voltage of ±18V and package style in-line with shrink pitch. Ideal for applications requiring high-speed switching in electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 2,289 parts In-Stock

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Digiode

USA . 1,934 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 5 parts In-Stock

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Problanco Electronics

Mexico . 7,962 parts In-Stock

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TANS Electronics

Latvia . 5,048 parts In-Stock

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SupplyDigital Components

Austria . 2,611 parts In-Stock

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Kepictronics

USA . 1,500 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 869 parts In-Stock

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Kulean Microsystems

USA . 836 parts In-Stock

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Corphita

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Corohmni

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Overview

Elevate your electronic designs with the LC78213 by Onsemi, a top-of-the-line multiplexer and switch that boasts superior quality and performance. With Onsemi's reputation for excellence in semiconductor manufacturing, you can trust that this product is built to last. Ideal for a wide range of applications, this versatile component offers unparalleled value and benefits to customers looking for reliable and efficient solutions. Upgrade your projects today with the LC78213 and experience the advantages it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Nominal Supply Voltage (Vsup): 18 V

The 18V supply voltage allows for compatibility with a wide range of systems and ensures stable performance.

No. of Terminals: 30

With 30 terminals, this product offers ample connectivity options for various input and output devices.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70 °C enables reliable performance even in harsh environments.

Technology: CMOS

The CMOS technology ensures efficient power consumption and reliable operation, making it a cost-effective choice.

Technical Specifications

Multiplexers & Switches LC78213 attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

JESD-30 Code:

R-PDIP-T30

Nominal Negative Supply Voltage (Vsup):

-18 V

No. of Terminals:

30

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP30,.4

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

+-18

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Nominal Supply Voltage (Vsup):

18 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

1.78 mm

Terminal Position:

DUAL

Trade Compliance

LC78213 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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