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LC78211

Onsemi

LC78211 by Onsemi

LC78211 by Onsemi is a CMOS multiplexer with 30 terminals, operating at temperatures from -30 to 70 °C. It has a supply voltage of ±18V and terminal pitch of 1.78mm. This rectangular package is ideal for applications requiring high-speed switching in electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Cyclops Electronics Ltd

UK . 10,486 parts In-Stock

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Vyrian

USA . 1,986 parts In-Stock

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Sinequanon

UK . 285 parts In-Stock

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Digiode

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LIBRA Elektronik GmbH

Germany . 90 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 21 parts In-Stock

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GreenTree Electronics

Israel . 5,000 parts In-Stock

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Problanco Electronics

Mexico . 4,699 parts In-Stock

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TANS Electronics

Latvia . 2,939 parts In-Stock

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SupplyDigital Components

Austria . 2,332 parts In-Stock

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Kepictronics

USA . 2,140 parts In-Stock

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Corphita

USA . 1,261 parts In-Stock

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UHIMA Technologies

Türkiye . 458 parts In-Stock

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Corohmni

South Africa . 428 parts In-Stock

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Kulean Microsystems

USA . 150 parts In-Stock

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Overview

Unlock the potential of your electronic designs with the LC78211 by Onsemi. This high-quality multiplexer & switch offers unparalleled reliability and performance, thanks to Onsemi's reputation for excellence in manufacturing. Perfect for a wide range of applications, this product provides customers with unmatched value, benefits, and advantages. Upgrade your projects today with the LC78211 and experience the difference that Onsemi quality can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material provides durability and protection for the internal components of the multiplexer or switch.

Nominal Supply Voltage (Vsup): 18 V

The 18V nominal supply voltage ensures compatibility with a wide range of power sources, making it versatile for different applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product can withstand relatively high temperatures, making it suitable for various environments.

Technology: CMOS

The CMOS technology used in this multiplexer or switch ensures low power consumption and high noise immunity, leading to better performance and energy efficiency.

Terminal Pitch: 1.78 mm

The 1.78mm terminal pitch allows for easier connections and installation, making it user-friendly and convenient for integration into existing systems.

Technical Specifications

Multiplexers & Switches LC78211 attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

JESD-30 Code:

R-PDIP-T30

Nominal Negative Supply Voltage (Vsup):

-18 V

No. of Terminals:

30

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP30,.4

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

+-18

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Nominal Supply Voltage (Vsup):

18 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

1.78 mm

Terminal Position:

DUAL

Trade Compliance

LC78211 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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